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• Sn-6Bi-2Ag(Cu，Sb)无铅钎料合金微观组织分析

  来源： 《中国有色金属学报2002年第3期》——黄明亮 于大全 王来 王富岗

    ......

• Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders

  来源： 《中国有色金属学报(英文版)2005年第5期》——周健 孙扬善 薛烽

  of the contact angle is obtained from the solder with 0.1% Nd addition. Key words: lead-free solder; zinc; neodymium; lanthanum; surface tension; wettability CLC number: TN604 Document code... recently been considered a candidate for lead-free solder material because of its low melting point (198℃), excellent mechanical properties and low cost. However, since Zn-contained alloys have......

• Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

  来源： 《中南大学学报(英文版)2008年第3期》——卢斌 栗慧 王娟辉 朱华伟 焦羡贺

  solder alloys have been carried out, due to environmental problems and health concerns about products that contain lead. Sn-Ag-Cu alloys are expected to be one of the most reliable lead-free solders[1-3... on Cu substrates. Consequently, the Cu6Sn5 IMC is reduced in thickness. It is reasonable to believe that a similar effect may occur when Ce element is added to a Sn-3.0Ag-0.5Cu lead-free solder system......

• 半导体激光软钎焊Sn-Ag-Cu焊点微观组织

  来源： 《中南大学学报(自然科学版)2006年第2期》——韩宗杰 鞠金龙 薛松柏 方典松 王俭辛 姚立华

   ......

• Interfacial reactions between Sn-2.5Ag-2.0Ni solder andelectroless Ni(P) deposited on SiC_p/Al composites

  来源： 《中国有色金属学报(英文版)2010年第6期》——吴茂 曲选辉 何新波 任淑彬 秦明礼 Rafi-ud-din

  , SHIH D Y, LEE T Y. Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization [J]. J Mater Res, 2004, 19(8): 2428-2436. [20] ZENG K, TU K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology [J]. Mater Sci Eng R, 2002, 38(2): 55-105. [21] KIM S W, YOON J W, JUNG S B. Interfacial reactions......

• 无铅锡基钎料合金设计和合金相图及其计算

  来源： 《中国有色金属学报2004年第11期》——乔芝郁 谢允安 曹战民 袁文霞 孙勇 祁更新

  , Sb等低熔点金属和微量Ce, La等稀土元素以降低贵金属In和Ag的含量, 进一步提高无铅锡基多元合金钎料的综合性能和性能价格比. 关键词: 钎料合金; 无铅钎料; 相图; 相图计算 中图分类号: TG113.14 文献标识码: A Design of lead-free solder alloy and alloy phase diagram calculation QIAO... of Materials and Metallurgical Engineering, Kunming University of Science and Technology, Kunming 650093, China) Abstract: The principles for lead-free solder alloy design and the importance of phase......

• EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

  来源： 《Acta Metallurgica Sinica2006年第4期》——L. Zhou X.Q. Wei H.Z. Huang G.L. Guo X.D. Liu

  of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found...%. The total thickness of the reaction layer(s) between the alloy and Cu was found to increase linearly with the Zn concentration. Key words:lead-free solder; Sn-Zn alloy; wettability; interface......

• SnAgCuRE系无铅钎料与表面贴装元器件的润湿适配性

  来源： 《中国有色金属学报2006年第11期》——张柯柯 王双其 余阳春 王要利 樊艳丽 程光辉 韩丽娟

  : A Wetting match performance of SnAgCuRE lead-free solder for surface mount component ZHANG Ke-ke, WANG Shuang-qi, YU Yang-chun, WANG Yao-li,FAN Yan-li, CHENG Guang-hui, HAN Li-juan (College of Materials Science and Engineering, Henan University of Science and Technology,Luoyang 471003, China) Abstract: The wetting match performances of SnAgCuRE lead-free solder for surface mount component......

• Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

  来源： 《Rare Metals2009年第6期》——CHEN Wenxue, XUE Songbai, WANG Hui, WANG Jianxin, and HAN Zongjie College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing , China

  .%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed...Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrateCHEN Wenxue, XUE Songbai, WANG Hui, WANG Jianxin, and HAN Zongjie College of Materials......

• 界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA焊点界面IMC形成与演化的影响

  来源： 《金属学报2011年第5期》——李勋平 周敏波 夏建民 马骁 张新平

  界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA焊点界面IMC形成与演化的影响李勋平1,周敏波1,夏建民1,马骁1,张新平1(1.广东省广州市华南理工大学材料科学与工程学院)摘 要:研究了焊盘材料界面耦合作用对Cu(Ni)/Sn-3.0Ag-0.5Cu/Cu(Ni)BGA(Ball Grid Array)结构焊点焊后态和125℃等温时效过程中界面金属间化合物(IMC)的成分,形貌和生长动力学的影响.结果表明.凸点下金属层(UBM)Ni界面IMC的成分与钎料中Cu含量有关,钎料中Cu含量较高时界面......