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for electronic packaging MA Ru-long, PENG Chao-qun, WANG Ri-chu, ZHANG Chun, XIE Li-chuan (School of Materials Science and Engineering, Central South University, Changsha 410083, China) Abstract: Diamond/aluminum composites, the fourth generation of electronic packaging materials, have attracted much attention for their remarkable comprehensive properties, such as high thermal conductivity, low coefficient......
by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have... with gold finishes and soldered with Sn-Pb alloy without any difficulty. Key words: spray forming; Si-Al alloy; electronic packaging material; coefficient of thermal expansion  ......
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="ChDivSummary" name="ChDivSummary">Solid wastes generated by the metallurgical industry contribute significantly towards the enhancement of environmental pollution. The handling, utilization, and safe disposal of these solid wastes are major concerns for the world. Dolochar is such a solid waste generated by the sponge iron industry. Investigations were carried out on the physical, mineralogical, and chemical......
Introduction With the rapid development of electronic industry, component size reduction and computing capability increase, 30% of current chip performance was limited by packaging materials [1]. It poses... Trans. Nonferrous Met. Soc. China 22(2012) 1686-1692 Microstructure and properties of Al/Si/SiC composites for electronic packaging ZHU Xiao-min, YU Jia-kang, WANG Xin-yu State Key Laboratory......
Electronic structures of TiN and TiC-Extension of Molecular Orbital Method into Crystals Gaoling Zhao1,Bin Song2 (1.State Key Lab laboratory of Silicon Materials, Department of Materials Science... and theoretical X-ray emission spectra for the valence bands of TiN and TiC are obtained with a molecular orbital method. In order to describe electronic structures of crystals, local clusters for the molecular......
桂林"MICE Industry"空间竞争与合作黄燕玲,程道品,张婷摘 要:通过实际调研,文献调查,图表分析法对著名旅游城市桂林进行诊断,分析"M ICEIndustry"区域城市空间竞争要素及合作的必然性;通过论述桂林市在旅游发展中所面临的机遇与挑战,提出桂林"M ICE Industry"接轨"泛珠三角经济区"基本框架以促进桂林"M ICEIndustry"可持续快速发展.关键词:MICE;旅游;城市竞争与合作;桂林;......
Luoyang Institute of Refractories Research Ministry of Metallurgical Industry钟香崇摘 要:<正> The Luoyang Institute of Refracto-ries Research(LIRR) under the Ministry ofMetallurgical Industry was founded in1964 and is a center for research and de-velopment on refractories science and te-chnology in People’ s Republic of China. Itis located in Luoyang......
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J. Cent. South Univ. (2020) 27: 1611-1623 DOI: https://doi.org/10.1007/s11771-020-4394-y New development of powder metallurgy in automotive industry TAN Zhao-qiang(谭兆强)1, 2, ZHANG Qing(张青)2, GUO... 2020 Abstract: The driving force for using powder metallurgy (PM) mostly relies on its near net-shape ability and cost-performance ratio. The automotive application is a main market of PM industry......