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Article ID: 1003-6326(2005)03-0619-07 Corrosion electrochemical behavior of brass tubes in circulating cooling seawater LU Yu-zhuo(卢玉琢)1, SONG Shi-zhe(宋诗哲)1,2, YIN Li-hui(尹立辉)1 (1...: Electrochemical impedance spectroscopy(EIS) and electrochemical noise(EN) were used to study the corrosion electrochemical behavior of brass tubes in circulating cooling seawater using the developed sensor......
ELECTROCHEMICAL MEASUREMENTS OF COMPONENT ACTIVITIES IN METALLURGICAL SLAGS D.Janke1,O.Volkova1,P.R.Scheller1 (1.Institute of Iron and Steel Technology, TU Bergakademie Freiberg, D-09596 Freiberg, Germany) Abstract:The up-to-date status of FeO, CaO, SiO2, P2 O5, Ti2 O3 and Cr2 O3 activity measure-ments in metallurgical slags using electrochemical sensors is outlined. A descriptionof......
) ceramics during polishing and the effects of ceramic microstructure on the surface quality were also reported. Experimental results show that the second phase in SiC ceramics plays an important role... and hardness between two phases. Under 3 μm abrasive grains polishing condition, different SiC ceramics show different removal mechanisms. With decreasing abrasive grain size, all of different SiC......
Electrochemical deposition of aluminum on W electrode from AlCl3-NaCl melts KAN Hong-min(阚洪敏)1, WANG Zhao-wen(王兆文)2, WANG Xiao-yang(王晓阳)1, ZHANG Ning(张 宁)1 1. Key Laboratory of Advanced...; Abstract: Electrochemical deposition of aluminum on W electrode from AlCl3-NaCl melts was studied by cyclic voltammetry and chronopotentiometry. The results show that Al (Ⅲ) is reduced......
of the electrochemical activation. The corrosion current density increases from 0.126 to 0.868 mA/cm2 with and without 2.0% (mass fraction) indium addition. The mean potentials of AP65 negatively shift from -1.491 V... the electrochemical anode and cathode polarization behavior of the alloy. Key words: magnesium alloy; corrosion; electrochemical properties; indium 1 Introduction Mg alloys have many advantages......
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Damage mechanisms during lapping and mechanical polishing CdZnTe wafersLI Yan,KANG Renke,GAO Hang,and WU Dongjiang Key Laboratory for Precision and Non-Traditional Machining Technology (Ministry of Education),Dalian University of Technology,Dalian 116024,China摘 要:CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface......
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