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and gyradisc crushers. For each flotation test, 650 g was ground to 80% passing 74 μm in a laboratory stainless steel ball mill with 9 mm steel balls at a pulp density of 67% (w/v). The mill......
is modeled as bonded assembly of rigid circular or ball. There are three basic bonded models: contact bond (CB) model, parallel bond (PB) model and flat joint (FJ) model. In the CB model, the particle point......
machining. Before sliding wear, the alloys were mechanically polished and then electro-polished in an electrolyte of 20 vol.% H2SO4 + 80 vol.% CH3OH. Ball-on- plate wear tests were done at room temperature under linear reciprocating model (Fig. 1(b)) with constant normal loading of 3 N. GCr15 balls with diameter of 6 mm acted as counterfaces. The steel ball was slided......
angular shaped Ti powders having an average size of 36 μm (Grade 2, Alfa Aesar) together with PVA (0.4 vol.%) as binder. Ti powders and PVA were mixed in a ball mill rotating at 130 r/min and under Ar......
than 99.995%. Distilled water was used throughout the experiments. 2.2 Procedure About 0.2-0.4 g of the feed was mixed with various predetermined amounts of ferric oxide (0-0.6 g) in a ball mill......
was determined using an Innovatest Nemesis 9001 universal hardness tester. The ball (diameter of 2.5 mm) was held under a load of 613 N for 10 s. The electrical conductivity of the alloys was measured......
with the ear ball. In order to obtain clear SEM images,5-10 mm Pt conductive film was sprayed on the surface of the sample. After that, put the prepared samples into SEM for scanning, observe the samples......
[21].为实现柔性隔离层下同步充填放矿过程,颗粒的生成以如下3个步骤进行. 图1 同步充填留矿法数值试验模型 Fig. 1 Numerical test model of synchronous filling shrinkage method 1) 初始颗粒的生成:通过ball generate命令在墙体模型y轴方向0.08 cm到130 cm范围生成若干矿石颗粒,这......
carried out under a load of 187.5 kg using a 2.5 mm steel ball to determine the macrohardness of samples. The test was conducted on eight locations and the average value was taken as the final......
with rare earth element additions[J]. Materials Science and Engineering R, 2004, 44(1): 1-44. [19] CHUANG T H, YEN S F. Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball array package[J...-Cu solder ball grid array packages[D]. Taiwan: National Taiwan University, 2009. [120] 王俭辛, 赖忠民, 薛松柏. Sn-Cu-Ni(-Ce)焊点热循环可靠性[J]. 焊接学报, 2010, 31(2): 36-40.WANG Jian-xin, LAI Zhong-min, XUE Song-bai......
