共搜索到537条信息，每页显示10条信息，共54页。用时：0小时0分0秒773毫秒
Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为周敏波1,李勋平1,马骁1,张新平1(1.广东省广州市华南理工大学材料科学与工程学院)摘 要:利用差示扫描量热分析法结合焊点回流过程,研究了无Pb钎料Sn-3.5Ag与Cu基底构成的Sn-3.5Ag/Cu体系模拟焊点中早期界面反应及焊点形成过程中钎料熔化和凝固特性.结果表明,加热过程中Cu向钎料合金侧的固态原子扩散导致界面生成低熔点Sn-Ag-Cu三元合金,使焊点界面在低于Sn-3.5Ag钎料熔点温度近4℃时即开始熔化;早期界面反应促使润湿过程提早发生并生成了......
, the (CuxNi1-x)6Sn5 layer is formed at the solder/pad interface during reflow. Key words: solder droplet; bump; lead-free solder; reflow; intermetallic compound 球栅阵列, 倒扣芯片等面阵列封装技术的关键为凸点制作[1-3], 凸点的... are distributed into solder matrix, and Ni layer is exposed to solder and reacts with solder directly. Distinctive difference exists between the intermetallics formed at Pb-free solder/pad interface and SnPb......
K. 无铅钎焊技术[M]. 宁晓山, 译. 北京: 科学出版社, 2004: 138-152.SUGANUMA K. Lead-free soldering technology[M]. NING Xiao-shan, transl. Beijing: Science Press, 2004: 138-152. [2] STELLER A, PAPE U, BLAIR L. Solder... Ning, YU Sheng-lin. Effect of temperature and coatings on Sn-Cu-Ni lead-free solder wettability[J]. Transactions of the China Welding Institution, 2006, 27(10): 53-56. [5] 李臣阳, 张柯柯, 王要利, 赵 恺, 杜宜乐. Ni元......
of SnPb solder, but its creep resistance is worse than that of the other lead-free solders. Particle-reinforcement is a way to improve the creep resistance of solder alloys and cause much more... distribution in small crept lead-free in-situ composite and non-composite solder joints [J]. Materials Science and Engineering, 2000, A285: 25-29. [6] GUO F, LEE J, CHOI S, LUCAS J P, BIELER T R......
: A Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, SUN Da-qian, LI Ming-gao (School of Materials Science and Engineering, Jilin University, Changchun 130025, China) Abstract: The influences of the addition of Bi, Ag to Sn-9Zn lead-free solder on the microstructure, wettability and mechanical properties were studied. The results......
Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应田艳红1,杨世华1,王春青1,王学林1,林鹏荣1(1.黑龙江省哈尔滨市哈尔滨工业大学现代焊接生产技术国家重点实验室)摘 要:采用直径范围为200-600μm的Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘上制作热风重熔焊点,将重熔焊点在150℃下进行老化,并对重熔和老化焊点进行剪切测试.结果表明:重熔和老化后焊点的剪切强度都随体积的增大而减小,表现出显著的体积效应.SEM断面观察显示:较小体积焊点剪切断裂发生在钎料块体内部,表现出较好韧性;较大体积焊点则......
. REFERENCES [1] YIN L, WEI S, XU Z, GENG Y. The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures[J]. Journal of Materials Science: Materials..., XIAO X. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys[J]. Journal of Materials Science. 2011, 46(10): 3424-3429. [6] 尹立孟, 姚宗湘, 耿燕飞, 林捷翔, 陆宇浩. Sn-0.3Ag-0.7Cu 低银无铅......
Trans. Nonferrous Met. Soc. China 28(2018) 1166-1175 Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition Kannachai KANLAYASIRI, Rachata KONGCHAYASUKAWAT... properties of the Sn-0.6Cu-0.05Ni-Ge (SCNG) lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x (x......
