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intermetallic phase [3,4]. Moreover, the SAC solders are costlier due to the high Ag content and the surface of the soldered joints is dull [1,5,6]. The Sn-Cu-Ni-Ge lead-free solder (or SN100C) is a strong..., QI L, WANG X M, WANG L. Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead-free solder [J]. Journal of Alloys and Compounds, 2004, 375: 196-201. [17] RIZVI M J......
凸点/焊盘的微观组织 Fig.3 Microstructures of SnPb solder bump/pad after reflowed 60s 图4 SnAgCu钎料凸点/焊盘经不同时间再重熔后界面的微观组织 Fig.4 Microstructures of interface between eutectic Sn-Ag-Cu solder.... Solidification Technology[M]. Beijing: China Machine Press, 1998. 75-83. [17]Park J Y, Yang C W, Ha J S, et al. Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film......
Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder SamplesJing Han1,Hongtao Chen1,Mingyu Li1,2,Chunqing Wang21. Department of Materials Science and Engineering,Shenzhen Graduate School,Harbin... have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy(SEM) was employed......
Ning, YU Sheng-lin. Effect of temperature and coatings on Sn-Cu-Ni lead-free solder wettability[J]. Transactions of the China Welding Institution, 2006, 27(10): 53-56. [5] 李臣阳, 张柯柯, 王要利, 赵 恺, 杜宜乐. Ni元... of Sn2.5Ag0.7Cu0.1RE/Cu solder joints[J]. Transactions of the China Welding Institution, 2012, 33(11): 39-42. [6] YU D Q, WANG L. The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu......
on a lot of unrealistic assumptions[19]. The global trend of lead free soldering makes lead-free solders, especially the SnAgCu solder, gradually substitute for the Sn-Pb solder in solder jet packaging... and solidification effects to predict the solder bump formation under nonequilibrium conditions. Development of the free surface flow modeling technique provides feasibility for modeling the droplet impingement onto......
: A Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, SUN Da-qian, LI Ming-gao (School of Materials Science and Engineering, Jilin... to 1.5%Ag(mass fraction) to Sn-9Zn lead-free solder, the wettability and shearing strength of joint decreases. The micro-structures of Sn-9Zn-Bi solder system are composed of β-Sn matrix, Zn-rich phase......
Microstructure and mechanical property of Sn–Ag–Cu solder materialYi-Gang Kong1,Zhi-Gang Kong21. School of Mechanical Engineering, Taiyuan University of Science and Technology2. Research Laboratory of Electrical Contacts, Beijing University of Posts and Telecommunications摘 要:Among the lead-free solder materials,Sn-AgCu alloys have many advantages......
,Ni,Cu,Sn)四元相,导致焊点强度弱化.关键词:激光喷射钎料球键合； 界面组织； 冷热循环； Sn-Ag-Cu钎料......
Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu SubstrateQiulian Zeng 1,2) , Jianjun Guo 1) , Xiaolong Gu 1) , Xinbing Zhao 2) and Xiaogang Liu.... Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed......
model of Ag nanoparticle-modified graphene/Sn-Ag-Cu/Cu solder joints [J]. Materials Science and Engineering A, 2020, 777: 139080. [5] WU C M L, YU Da-qun, LAW C M T, WANG L. Properties of lead-free... solder [J]. Journal of Alloys & Compounds, 2019, 781: 761-772. [17] KHODABAKHSHI F, SAYYADI R, JAVID N S. Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical......
