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thin film substrates using AuSn solder bumps[J]. Materials, Technology and Reliability of Advanced Interconnects, 2005, 863(35): 327-338. [23] KIM S, KIM K S, KATSUAKI S. Interfacial reactions of Si die......
operation: A general conceptual model with a case study at Three Gorges Reservoir [J]. Acta Geotechnica, 2014, 9(5): 771–788. [14] TERZAGHI K. Die berechnung der durchlassigkeitsziffer des tones aus......
as free forging (open die forging) was used to deform spark plasma sintered Ti-51%Ni SMA and the result was compared with specimen processed without free forging (unforged specimen) in terms......
. Elongation of zinc monocrystals under ultrasonic action [J]. Die Natur Wissenschafen, 1955, 42(20): 556. [3] LANGENECKER B. Effects of ultrasound on deformation characteristics of metals [J]. IEEE......
, 2015, 26: 2821-2826. (in Chinese) [24] LI Rong-jiu. Ceramic–metal complex materials [M]. Beijing: Metallurgical Industry Press, 1995. (in Chinese) [25] YAO Ze-kun. Forging technology and die design [M......
, whose grains are squashed and elongated (Figs. 8(a) and (b)). The inhomogeneous phenomenon of strain can be attributed to the effect of the contact and friction behavior between specimen and die......
wherein; the processed powder was first charged in the graphite die, followed by sintering at 823 K for 6 min at a heating rate of 823 K/min. This is the similar sintering condition that was used......
uniaxially compacted in a die at a pressure of 200 MPa and a crosshead speed of 2.0 mm/min into cylindrical green scaffolds with a diameter of 10 mm and a height of 15......
for recrystallized microstructure modeling of severely deformed copper [J]. Journal of Materials Science, 2008, 43: 6081-6086. [40] HOSSEINI E, KAZEMINEZHAD M. The effect of ECAP die shape on nano-structure......
by Chongqing Foundation and Frontier Research, China; Project (P2017-020) supported by Open Fund Project of State Key Laboratory of Materials Processing and Die & Mould Technology, China......