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与Cu/Ni镀层钎焊接头的界面反应[J]. 中国有色金属学报, 2007, 17(3): 410-416. DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing, TIAN Yan-hong, KONG Ling-chao. Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings......
, 1994, 16(S2): 98-101. [13] 陈杰, 周鸿章, 钟掘. CVC四辊铝冷轧机工作辊辊型设计[J]. 轻合金加工技术, 2000, 28(3): 12-13. CHEN Jie, ZHOU Hongzhang, ZHONG Jue. Design of the work roll shape of 4 - h CVC mill[J]. Light Alloy......
, LIU C Y. Numerical analysis of novel SiC3D/Al alloy co-continuous composites ventilated brake disc [J]. International Journal of Heat and Mass Transfer, 2017, 108: 1374-1382. [21] HOU Jian-feng, PAN......
-zhong. Current development of zinc and zinc alloy electroplating[J]. Clectroplating & Finishing. 2003, 22(6): 40-45. [5] 孙德堃. 国内外锌冶炼技术的新进展[J]. 中国有色冶金, 2004, 6(3): 5-8. SUN De-kun. New progress......
and corrosion resistant alloy[M]. Beijing: Metallurgical Industry Press, 2016: 2-14. [2] 曾祥婷, 许 虹, 田 尤, 等. 中国镍资源产业现状及可持续发展策略[J]. 资源与产业, 2015, 17(4): 94-99. ZENG Xiang-ting, XU Hong, TIAN You, et al. Situation......
结合性能评价[J]. 上海口腔医学, 2018, 27(5): 39-43. LIU Qiang, ZHANG Yi-neng, LI Hui-jun, et al. Evaluation of bone bonding properties of domestic porous tantalum-niobium alloy materials[J]. Shanghai Stomatology......
Boundary conditions and activity coefficients Four products were considered for the oxidative smelting process, namely, Pb-Bi metal alloy, oxidized slag, matte and dust. The typical Bi, Pb, As, Sb......
alloy product[J]. Nonferrous Metals Processing, 2020, 49(2): 4-6, 11. [3] 吴 田. 镍基体系三维电极材料的制备及其电化学性能研究[D]. 北京: 中国科学院大学, 2018. WU Tian. Synthesis and electrochemical performance study of nickel-based......
on Components, Packaging and Manufacturing Technology, 2020, 10(5): 845-857. [8] WU C P, YI D Q, WENG W, et al. Influence of alloy components on arc erosion morphology of Ag/MeO electrical contact materials... emission and work function of silver-zinc oxide Ag-ZnO (92/8) pseudo-alloy electrical contacts[J]. Materials Science and Engineering, 2019, 634: 012032. doi:10.1088/1757-899X/634/1/012032. Influence......
bonding for 60 s. However, upon bonding for 300 s, the strength of the bondline approached that obtained by soldering a Pb-5Sn alloy [23]. Upon increasing the bonding temperature to 300 ......