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keV, 18 kW, Cu Kα) X-ray diffractometer and electron probe micro-analyzer (EPMA, JXA-8530F). 3 Results and discussion 3.1 Densification behavior of niobium-alloying steels Figure 1 shows......
distribution in an in-situ grown Al–TiB2 composite by synchrotron X-ray diffraction and electron microscopy [J]. Materials Characterization, 2015, 102: 131-136. [26] KOCKS U F, MECKING H. Physics......
IGZO transistors [J]. IEEE Electron Device Letters, 2016, 37(3): 299-302. DOI: 10.1109/LED.2016. 2517080. [21] HE Y, KULASIRI D, LIANG J. A mathematical model of synaptotagmin 7 revealing functional......
observation was performed using a Mira3-XMU Tescan field emission scanning electron microscope (ESEM) equipped with an energy dispersive spectroscopy (EDS) device to perform phase microanalysis......
从微观角度全面认识钴对羟肟萃取剂毒化产生的原因,采用价键理论和杂化理论从微观分子层面对羟肟萃取体系中钴的氧化电位,配位状态,空间结构和杂化方式进行研究显得尤为重要. 图2 不同杂化方式下Co2+的最外层电子排布 Fig. 2 Outermost electron arrangement of Co2+ under different hybridization......
of the microstructure and elemental composition of different phases was characterized using scanning electron microscopy (SEM; ZEISS SUPER 55VP) with energy-dispersive spectroscopy (EDS). 2.3 Coating characterization......
electron microscopy and high-angle annular detector dark-field scanning transmission electron microscopy[J]. Materials Transactions, 2009, 50(7): 1747-1752. [88] NATARAJAN A R, VAN DER VEN A. A unified......
structure of alloy in hot rolled state and solid solution state[64] 图33 Cu-15Ni-8Sn-1.0Zn-0.8Al-0.2Si合金经(400 ℃, 30 min)预时效+60%冷轧变形+(450 ℃, 2 h)时效处理的透射电子显微照片[64] Fig. 33 Transmission electron...;450 ℃预时效8 h后Cu-Ti合金的高分辨电镜观察[71] Fig. 39 High-resolution electron microscope observation of Cu-Ti alloy after pre-aging at 450 ℃ for 8 h[71] 2.4 超高强Cu-Ni-Al-Si合金 Cu-Ni-Al-Si合金有高强度,优良的高温热稳定......
D G, KANG H B, SUH S J, YANG C W, LEE C B, JUNG J M, YOO C S, JUNG S B. Intermetallic compounds layer growth at the interface between Sn-Cu-Ni solder and Cu substrate[J]. Journal of Alloys......
): 86-90. [7] ELECTRON P P. MCM process combines beryllia substrate[J]. Electronic Packaging and Production, 1996, 36(9): 81. [8] 尹衍升, 张景德. 氧化铝陶瓷及其复合材料[M]. 北京: 化学工业出版社, 2001.YING Yan-sheng, ZHANG Jing-de......