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of reinforcement particles to a conventional solder alloy[5-9]. Study of MARSHALL et al[10] showed that the mechanical properties of powdered Cu6Sn5 intermetallics reinforced composite solder were... Effect of stress on creep rupture life of solder joints: (a) 50 ℃; (b) 75 ℃; (c) 100 ℃; (d) 125 ℃ Fig.5 Microstructure of solder alloy: (a) Eutectic 99.3Sn0.7Cu solder; (b) Microstructure......
effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250...℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 ......
film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%, mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy, the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5, the growth of the IMC layer is mainly controlled by a diffusion over the studied time range......
(c), 500 h (d) and 1 000 h (e) 4 Conclusions 1) Sn2.5Ag2.0Ni alloy was utilized to solder SiCp/Al composites substrates deposited with electroless Ni(5%P) and Ni(10%P) layers. Two kinds of micro... structure solder joint with Ni(P)/Cu metallization on Cu substrate [J]. J Alloy Compd, 2007, 437(1/2): 169-179. [12] SHARIF A, CHAN Y C. Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn......
conditions. Key words: lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability ... straining for solder alloy 63Sn-37Pb [J]. Mechanics of Materials, 2005, 37(7): 801-814. [5] CHEN Gang, CHEN Xu. Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic......
="ChDivSummary">To improve the properties of Sn10Sb8Cu solder alloy, two new solders (SnSbCuAg and SnSbCuNi) were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1°C and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4°C......
, Sb等低熔点金属和微量Ce, La等稀土元素以降低贵金属In和Ag的含量, 进一步提高无铅锡基多元合金钎料的综合性能和性能价格比. 关键词: 钎料合金; 无铅钎料; 相图; 相图计算 中图分类号: TG113.14 文献标识码: A Design of lead-free solder alloy and alloy phase diagram calculation QIAO... of Materials and Metallurgical Engineering, Kunming University of Science and Technology, Kunming 650093, China) Abstract: The principles for lead-free solder alloy design and the importance of phase......
Effect of solidification on solder bump formation in solder jet process: Simulation and experiment TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红) School of Materials...; Abstract: To investigate the influence of the solidification on the solder bump formation......
Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures... compounds (IMC) and Ce compounds also exist. Microstructure of solder alloy becomes finer with the increase of the content of Ce, and the optimum content of Ce is about 0.03%, the binary eutectic of needle......
Microstructure and mechanical property of Sn–Ag–Cu solder materialYi-Gang Kong1,Zhi-Gang Kong21. School of Mechanical Engineering, Taiyuan University of Science and Technology2. Research Laboratory of Electrical Contacts, Beijing University of Posts and Telecommunications摘 要:Among the lead-free solder materials,Sn-AgCu alloys have many advantages......
