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℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 .... The solidus, wettability and spreadability of the fine solder powder were investigated in order to assess the effect of Ce on the properties of lead-free Sn-Ag-Cu- Ce micron- (or nano-) powdered solder. 2 ......
of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress-strain curves were compared... conditions. Key words: lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability ......
Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloyHui-zhen Huang,Xiu-qin Wei,Dun-qiang Tan,Lang ZhouSchool of Materials Science and Engineering, Nanchang University摘 要:This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior......
Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive... of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu(SAC305)/ Cu solder joints aging at 373,403,and 438 K.The results show that(Cu1 x,Nix)6Sn5phase......
Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solderMing-jie Dong, Zhi-ming Gao, Yong-chang Liu, Xun Wang, and Li-ming Yu School... 195?C), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance......
Effects of Ga,Al,Ag,and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solderWANG Huia, XUE Songbaia, ZHAO Fengb, and CHEN Wenxuea a College of Materials Science and Technology...="ChDivSummary">An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show......
are regarded as the most potential lead-free solder system in the electronics. For an actual replacement for the lead-containing solder, reliability of their solder interconnections, which is mainly...]. Microelectronics International, 1998, 15: 20－24. [14] ZENG K,Vuorinen V, Kivilahti J K. Interfacial reactions between lead-free SnAgCu solder and Ni(p) surface finish on printed circuit boards[J......
and discussion 3.1 Influence of laser output power on mechanical properties of QFP Sn-Ag-Cu micro-joints TQFP100 devices were soldered on PCB with Sn-Ag-Cu lead-free solder, and laser scanning speed... by molten Sn-Ag-Cu lead-free solder, and the best mechanical properties of micro-joints are gained at the same time. 3.2 Influence of laser output power on mechanical properties of QFP Sn-Cu-Ni......
intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder [J]. Journal of Materials Science: Materials in Electronics, 2014, 25(12): 5269-5276. DOI: 10.1007/s10854-014-2300-9. [10] AHMIDO... of Alloys and Compounds, 2018, 748: 51-56. DOI: 10.1016/j.jallcom.2018.03.033. [14] WANG Ming-na, WANG Jian-qiu, KE Wei. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints [J]. Microelectronics......
in size to small lead-free solder joints used in electronic packaging and jointing) between thin copper strips were fabricated using lead-free solder (Sn-3.5Ag) to quantify their creep strains... The maximum rate of electronic-resistance strain measurement is 3.5×10-3 s-1. Key words: lead-free solder joint; micro resistance; creep strain; electronic-resistance strain 电子封装中,焊点机械性能失效是导致电子产品可靠性降低......
