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Polar Growth Habit of KABO Crystal Zhang Xuehua1,Luo Haosu1,Zhong Weizhuo1 (1.Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201800, China) Abstract:The polar growth habit of KABO crystal was discussed by the growth-units model of anionic coordination-polyhedra (ACP), and the relationship between stabilities of incorporation of those growth-units into various group faces......
锆/镍超声波焊接界面IMCs生长行为及其性能分析张义福1,2,张华1,朱政强1,潘际銮11. 江西省机器人与焊接自动化重点实验室南昌大学机电工程学院2. 九江学院机械与材料工程学院摘 要:锆/镍异种金属焊接结构在现代工业应用中日益广泛,但因母材热物理和化学性能存在较大差异,导致焊接难度大.超声波焊接作为一种固态连接工艺适应于异种金属焊接.研究不同焊接能量对锆/镍异质金属超声波焊接金属间化合物(IMCs)生长行为与机械性能的影响机制.以锆箔,镍箔为原材料,采用焊接功率1600 W,通过改变焊接时间300,~400,~500,~600 ms调控焊接能量设计异质金属超声波焊接试验.使用扫描电子显微镜(SEM),能谱仪(EDS), X射线衍射(XRD), 3D景深显微分析,显微硬度仪及拉剪强度测试等研究微观组......
">The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds(IMCs) layer(η-Cu6 Sn5 + e-Cu3 Sn) for various soldering... IMCs increased, meanwhile, the grain size of Cu6 Sn5 also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs,but excessive Bi(≥ 5 wt%) inhibited the growth......
thermal processes. Thermal history has considerable effect on the viscosity. The viscosity in the cooling process with high superheating is greater than that in the cooling process with low superheating......
formed in Ag-rich areas of the molten Sn and adsorbed by the Ag3Sn grains during solidification process. Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolic relationship... withstand operation temperature approximately 480 °C according to the phase diagram. Nevertheless, growth process of the IMCs probably affects the mechanical integrity of the TLP-bonded joint, for example......
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behavior of Al3Ni intermetallic compounds(IMCs)during the directional solidification of Al-10 wt%Ni alloy was investigated by synchrotron radiography.Two main growth patterns of primary Al3Ni phase,I...In situ Study on the Growth Behavior of Primary Al3Ni Phase in Solidifying Al–Ni Alloy by Synchrotron RadiographySi-Yu Sun,Qiao-Dan Hu,Wen-Quan Lu,Zong-Ye Ding,Ming-Qin Xu,Ming-Xu Xia,Jian-Guo......
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Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging毕晓阳,胡小武,LI Yulong,JIANG XiongxinKey Lab for Robot and Welding Automation of Jiangxi Province, Nanchang University摘 要:The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound(IMC......
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