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and performance of Sn-Ag-Cu lead-free BGA solder joint YANG Miao-sen1, 2, SUN Feng-lian1, KONG Xiang-xia1, ZHOU Yun-fang1 (1. School of Material Science and Engineering, Harbin University of Technology, Harbin 150080, China; 2. School of Mechanical Engineering, Harbin Vocational and Technical College, Harbin 150081, China) Abstract: The nanoindentation was performed on the plasticity of Sn-Ag-Cu(SAC) lead-free......
accelerates the crystallization and growing up of IMC. Key words: lead-free solder; Sn-Ag-Cu alloy; IMC thickness; uniform design ...-free systems have been developed. Among the various alloy systems being considered as lead-free solder candidates, Sn-Ag-Cu alloys have been recognized as the most promising material because......
in industry and speeded the process. In recent years, the application of lead-free solder to consumer electronic products becomes reality. And among new generation of lead-free solders, Sn-Ag alloys... results that high cooling speed can significantly restrain the formation of bulk Ag3Sn IMCs in Sn-Ag lead-free solder and bulk Ag3Sn IMCs are inclined to form under relative lower cooling conditions[4......
Jian-xin, YAO Li-hua. Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering [J]. Journal of Central South University: Science and Technology, 2006, 37(2): 229-234. (in Chinese... of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress-strain curves were compared......
been demonstrated that lead-free soldering is technologically possible and has some advantages, there are many technical issues to be addressed before it is well implemented. The Sn-Ag-Cu alloys... Abstract: Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow......
; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新... vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively......
and discussion 3.1 Influence of laser output power on mechanical properties of QFP Sn-Ag-Cu micro-joints TQFP100 devices were soldered on PCB with Sn-Ag-Cu lead-free solder, and laser scanning speed... by molten Sn-Ag-Cu lead-free solder, and the best mechanical properties of micro-joints are gained at the same time. 3.2 Influence of laser output power on mechanical properties of QFP Sn-Cu-Ni......
Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为周敏波1,李勋平1,马骁1,张新平1(1.广东省广州市华南理工大学材料科学与工程学院)摘 要:利用差示扫描量热分析法结合焊点回流过程,研究了无Pb钎料Sn-3.5Ag与Cu基底构成的Sn-3.5Ag/Cu体系模拟焊点中早期界面反应及焊点形成过程中钎料熔化和凝固特性.结果表明,加热过程中Cu向钎料合金侧的固态原子扩散导致界面生成低熔点Sn-Ag-Cu三元合金,使焊点界面在低于Sn-3.5Ag钎料熔点温度近4℃时即开始熔化;早期界面反应促使润湿过程提早发生并生成了一定厚度的扇贝状Cu-Sn型金属间化合物(IMC),原体系转变为Sn-Ag-Cu/Cu体系;转变后的焊点体系在IMC的非均匀形核作用下具有较低的过冷度.关键词:无Pb钎料； 界面反应......
Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls He Lijun1,Shi Likai1,Zhang Shaoming1,Xu Jun1,Zhang Shuguang1 (1.National Engineering Research Center for Non... and Sn-4.0Ag-0.5Cu lead free solder balls with tight distribution and good sphericity of particles through optimization of processing parameters, forming a solid base for cost effectively producing solder balls. Key......
, CHAN Y C. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets [J]. Journal of Alloys and Compounds, 2016, 656(25): 500-509. [31] KORHONEN T M... C, DUH J G, CHIOU B S. Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder [J]. Journal of Electronic Materials, 2006, 35(1): 7-14. [18] SATYANARAYAN, PARBHU K N. Wetting......
