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Science, 2014(83): 103-110. [3] FANG H C, XIAO P, XIONG X, YU G J. Microstructures, mechanical and oxidation behaviors of C/C composites modified by NiAl alloy[J]. Transactions of Nonferrous Metals......
镀Ni层的消耗,避免形成过厚的IMC,准确控制液态停留时间是尤为重要的. REFERENCES [1] 孙 磊, 张 亮. Sn-Ag-Cu系无铅钎料的研究进展[J]. Electric Welding Machine, 2014, 44(12): 6-13. SUN Lei, ZHANG Liang. Research status of Sn-Ag-Cu lead-free solders[J...与Cu/Ni镀层钎焊接头的界面反应[J]. 中国有色金属学报, 2007, 17(3): 410-416. DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing, TIAN Yan-hong, KONG Ling-chao. Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings......
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and the distribution uniformity of the alumina directly affect the stability of the electrolytic process. A lower alumina concentration in the anode-cathode distance (ACD) can lead to an anode effect... distribution characteristic, but will lead to the achievement of more dissolved alumina and a more uniform alumina distribution, which is more conducive to electrolysis. 5 Conclusions (1) Bath......
, facilitating their removal by ADCP process. However, the impurities of Zn and Co have their distribution coefficient around 0.1, which can lead to a slow removal rate. It is known that the control... of temperature gradient in crystallizer The higher heat transfer efficiency at the bottom of the crystallizer would lead to changes of the crystal morphology and presence of a large number of irregular growth......
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