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Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current DensityHongwen He 1), Haiyan Zhao 1) , Fu Guo 2) and Guangchen Xu 2) 1) Department of Mechanical Engineering... layer formation in Cu/Sn–58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which......
on the properties of SnAgCu solder alloys. The addition of 0.03% (mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties, but slightly lower its melting temperature... are in good agreement with the theoretical ones. Key words: rare earth Ce; SnAgCu solder; creep behavior; constitutive equations ......
, USA摘 要:Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples...Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder JointsX.J. Wang1), Q.L. Zeng1), Q.S. Zhu1), Z.G. Wang1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials......
组织；剪切强度；蠕变断裂寿命 中图分类号:TG42 文献标志码:A Effects of RE on properties of Sn2.5Ag0.7Cu/Cu solder joints WANG Yao-li, ZHANG Ke-ke, QIAO Xin-he, QIAN Na-na, PAN Hong, L? Jie, L? Kun-yu... strength and creep rupture life of the Sn2.5Ag0.7Cu/Cu solder joints were investigated by X-ray diffractometry, JSM-5610LV scanning electronic microscopy. The results show that the intermetallic compound......
Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging毕晓阳,胡小武,LI Yulong,JIANG XiongxinKey Lab for Robot and Welding Automation of Jiangxi...) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6......
195?C), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance......
Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing processWEI Xiaofeng,WANG Richu,FENG Yan,ZHU Xuewei,and PENG Chaoqun School of Materials Science and Engineering... investigated during annealing at 453,523,and 543 K for up to 240 h.The Au/Sn combination formed a rapid diffusion system.Even in rolled Au-Sn solder,three phases,such as AuSn,AuSn2,and AuSn4,were formed.After......
Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel PatternK.J.HsiaDepartment of Mechanical Science and Engineering,University of Illinois at Urbana-Champaign,Urbana,IL 61801,USA摘 要:The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere(H2 5%+Ar 95%).Liquid solder spreading was observed to follow......
Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS) analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side: a planar Cu5Zn8 layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder......
Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to ElectromigrationM.Nasir Bashir,A.S.M.A.Haseeb,Abu Zayed Mohammad Saliqur Rahman,M.A.FazalDepartment of Mechanical Engineering, University of Malaya摘 要:Rapid Cu diffusion is one of the main causes of electromigration(EM) failure in lead-free solder......
