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higher affinity for Sn in the Sn-Pb system. This is an important foundation for the improvement of the metallurgical properties of Sn-Pb solder alloy by adding rare earth elements. [全文内容正在添加中] ...Thermodynamic Assessment of Interaction Relation between Lanthanum and Constituent Elements in Sn-Pb Alloy 钱乙余1,马鑫2,薛松柏4 (1.National Key Laboratory of Welding, Harbin Institute of Technology......
properties of the welded joint are attributed to the welding procedures, welding methods and solder wire. Many welding methods of 7A52 aluminum alloy have been reported[5-7]. These methods include metal inert... of solder wire and 7A52 aluminum alloy welded joint were measured and listed in Table 4. Table 4 Tensile properties of solder wire, base material and welded joint It can be seen from Table 4......
and the corrosion current density obviously declines, which improves the solder corrosion property. Key words: metallic materials; Sn-9Zn solder; Sn alloy; magnetic field; microstructure; microhardness... fields on microstructure, microhardness and electrochemical corrosion of Sn-9Zn solder WU Min1, 2, LIU Zheng-jun1 (1. School of Materials Science and Engineering, Shenyang University of Technology......
)Abstract:Stainless die with micro-groove and micro-hole have been designed and manufactured, which has been used to study superplastic microforming of 2091Al-Li alloy by means of superplastic forming... micro-rib specimen, behavior of material could be understood well.Key words:superplasticity; microforming; extrusion; 2091Al-Li alloy......
. Based on the present study, it can be concluded that the addition of rare earth Ce in SnAgCu solder alloys has potential to improve alloys properties, making the resulting alloy a better alternative... on the properties of SnAgCu solder alloys. The addition of 0.03% (mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties, but slightly lower its melting temperature......
Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in AirZhi-Wei Lai1,2,3,Zhe-Yuan Huang2,4,Chuan Pan3,Hui-Qiao Du5,Xiao-Guang...-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa......
properties Sn-9Zn solder alloy with trace rare earth elements[J]. The Chinese Journal of Nonferrous Metals, 2003, 13(4): 1001-1004. [10]林清枝. 物理化学[M]. 北京: 北京师范大学出版社, 2000. LIN Qing-zhi. Physical Chemistry...: A Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, SUN Da-qian, LI Ming-gao (School of Materials Science and Engineering, Jilin......
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder JointsX.J. Wang1), Q.L. Zeng1), Q.S. Zhu1), Z.G. Wang1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials..., USA摘 要:Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples......
; 凸点; 无铅钎料; 重熔; 金属间化合物 中图分类号: TG111 文献标识码: A Interface reaction of solder droplet/pad and intermetallic compounds evolution during reflow soldering LI Fu-quan, WANG Chun-qing, TIAN Yan-hong, KONG Ling-chao (School of Materials Science and Engineering,Harbin Institute of Technology, Harbin 150001, China) Abstract: The interface structures of solder droplet for SnPb and SnAgCu Al/Ni/Cu pad......
Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging毕晓阳,胡小武,LI Yulong,JIANG XiongxinKey Lab for Robot and Welding Automation of Jiangxi...) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6......
