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• Flattening behavior of copper droplets in plasma spray forming

  来源： 《中国有色金属学报(英文版)2007年增刊第1期(Part ⅡB)》——曾好平

  Flattening behavior of copper droplets in plasma spray forming ZENG Hao-ping(曾好平) School of Mechanical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; Received... parameters-droplet diameter, temperature and velocity, even though the flattening time decreases when the droplet velocity increase. Key words: copper droplets; flattening behavior; simulation; plasma......

• SELECTIVE COPPER REMOVAL FROM CUPRIFEROUS GOLD CONCENTRATE

  来源： 《中国有色金属学报(英文版)1995年第1期》——Deng Tong Muir David

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• 基于TEA和EDTA·2Na双络合体系的酸性镀铜工艺及镀层特性

  来源： 《中国有色金属学报2011年第8期》——张震 李俊

  : The copper foils for the anode current collectors of lithium-ion battery were prepared by electrodeposition. In order to obtain better electrodeposited copper foils, considering different electroplating...-class electrolytic copper foils[J]. World Nonferrous Metals, 2002(4): 8-11. [2] 黄 洁. 铜箔的生产技术及发展趋向[J]. 铜业工程, 2003(2): 83-84.HUANG Jie. Technology of copper foil manufacturing and its development......

• Sintering microstructure and properties of copper powder prepared by electrolyzation and atomization

  来源： 《中南大学学报(英文版)2021年第7期》——陈存广 李沛 秦乾 陆天行 邵艳茹 杨芳 郝俊杰 郭志猛

  J. Cent. South Univ. (2021) 28: 1966-1977 DOI: https://doi.org/10.1007/s11771-021-4745-3 Sintering microstructure and properties of copper powder prepared by electrolyzation and atomization LI Pei... and Springer-Verlag GmbH Germany, part of Springer Nature 2021 Abstract: The almost completely dense copper was prepared by ultrafine copper powder prepared with both methods of electrolysis and novel water......

• Effect of ultraviolet mutagenesis on heterotrophic strain mutation and bioleaching of low grade copper ore

  来源： 《中南大学学报(英文版)2017年第10期》——胡凯建 WU Ai-xiang吴爱祥 Wang Hong-jiang(王洪江) 张爱卿 杨莹

  J. Cent. South Univ. (2017) 24: 2245-2252 DOI: https://doi.org/10.1007/s11771-017-3634-2 Effect of ultraviolet mutagenesis on heterotrophic strain mutation and bioleaching of low grade copper ore WU... 2017 Abstract: The effect of ultraviolet mutagenesis on a heterotrophic strain (Providencia JAT-1) mutation was studied and bioleaching of low grade copper ore with mutant bacteria was investigated......

• Thermal expansion of MWCNT-reinforced copper composite

  来源： 《中国有色金属学报(英文版)2007年增刊第1期(Part ⅡB)》——许龙山 陈小华 潘伟英 李文华 杨植 蒲玉兴 易国军 易斌 张科

  Thermal expansion of MWCNT-reinforced copper composite XU Long-shan(许龙山), CHEN Xiao-hua(陈小华), PAN Wei-ying(潘伟英), LI Wen-hua(李文华), YANG Zhi(杨  植), PU Yu-xing(蒲玉兴), YI Guo-jun (易国军) , YI Bin... carbon nanotube (MWCNT)-reinforced copper composite was fabricated by a novel method, which involves solution phase synthesis of MWCNT-implanted cuprous oxide composite spheres, formation of MWCNT/ copper......

• Intelligent decision support system of operation-optimization in copper smelting converter

  来源： 《中南大学学报(英文版)2002年第2期》——姚俊峰 梅炽 彭小奇 周安梁 吴冬华

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• Effect of added cobalt ion on copper electrowinning from sulfate bath using doped polyaniline and Pb-Ag anodes

  来源： 《中国有色金属学报(英文版)2010年增刊第1期》——黄惠 周继禹 郭忠诚

  ­­Effect of added cobalt ion on copper electrowinning from sulfate bath using doped polyaniline and Pb-Ag anodes HUANG Hui(黄 惠)1, ZHOU Ji-yu(周继禹)2, GUO Zhong-cheng(郭忠诚)1 1. Faculty... December 2009 ____________________________________________________________________________________________ Abstract: Effect of added Co2+(aq) on copper electrowinning was studied using doped......

• Operation optimization of concentrate burner in copper flash smelting furnace

  来源： 《中国有色金属学报(英文版)2004年第3期》——陈红荣 梅炽 谢锴 李欣锋 周俊 王晓华 葛则令

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• Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

  来源： 《中国有色金属学报(英文版)2008年第1期》——田艳红 王春青 Y. Norman ZHOU

  Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...;   Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......