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High Temperature Oxidation as a Production Route for Electronic Materials () 摘要:Oxidation of metallic components often results in degradation and structural failure, preven-tion is therefore an important topic. On the other hand, oxidation process creates new products such as metal oxides, can be used as a production route. A well-known process in semiconductor industry is that oxidation......
;INTRODUCTION As a traditional alloy, Au-Cu system is extensively applied in catalysis, electronic industry and biological material field. Recently, some new functions of the alloy are found in nano-crystal...Electronic structure of Au-Cu alloys YU Fang-xin(余方新), XIE You-qing(谢佑卿), NIE Yao-zhuang(聂耀庄), LI Xiao-bo(李小波), PENG Hong-jian(彭红键), TAO Hui-jin(陶辉锦) (School of Materials Science and Engineering......
J. Cent. South Univ. (2018) 25: 2929-2943 DOI: https://doi.org/10.1007/s11771-018-3963-9 Industrial transmission effect of international metal price shocks in perspective of industry chain GAO... Institute, Changsha 410125, China Central South University Press and Springer-Verlag GmbH Germany, part of Springer Nature 2018 Abstract: Based on a new perspective of industry chain and selecting monthly......
; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum...Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG......
J. Cent. South Univ. Technol. (2010) 17: 888-894 DOI: 10.1007/s11771-010-0572-7 First-principle investigation on electronic structures and elastic properties of Al-doped MoSi2 LIU Xiao-liang(刘小... and Technology, Central South University, Changsha 410083, China ? Central South University Press and Springer-Verlag Berlin Heidelberg 2010 Abstract: The electronic structures and elastic properties of Al......
Conclusions 1) Based on the analysis of modern electronic packaging industry and the metal flow characteristics in semi-solid forming, a new forming technology of thixo-forming was used in manufacturing... Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School......
Recovery of gallium from phosphorus industry flue XU Ke(许 可), DENG Tong(邓 彤), DAI Yu-jie(戴玉杰), WANG Jing(王 静) (Institute of Process Engineering, Chinese Academy of Sciences, Beijing... flue dust is leached for 1h at 80℃, mass ratio of liquid to solid 4∶1 and stirring speed 800r/min. REFERENCES [1]Moskalyk R R. Gallium: the backbone of the electronics industry [J]. Minerals......
J. Cent. South Univ. (2017) 24: 2288-2293 DOI: https://doi.org/10.1007/s11771-017-3640-4 Electronic structure and flotability of gold-bearing pyrite: A density functional theory study LIU Dan(刘丹... Central South University Press and Springer-Verlag GmbH Germany 2017 Abstract: Various incorporation of Au in pyrite and its effects on the geometrical structure, electronic structure and flotability......
J. Cent. South Univ. (2021) 28: 39-47 DOI: https://doi.org/10.1007/s11771-021-4584-2 Stacking fault energy and electronic structure of molybdenum under solid solution softening/hardening LIU Pan(刘攀.... On the contrary, the elements of W, Ta, Ti, and Nb could bring about the solid-solution hardening of Mo through the impediment of the slip of the dislocation and the decrease of ductility. Electronic structures......
Introduction With the rapid development of electronic industry, component size reduction and computing capability increase, 30% of current chip performance was limited by packaging materials [1]. It poses... Trans. Nonferrous Met. Soc. China 22(2012) 1686-1692 Microstructure and properties of Al/Si/SiC composites for electronic packaging ZHU Xiao-min, YU Jia-kang, WANG Xin-yu State Key Laboratory......
