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钪和无机配位体的络合物的稳定常数(续表3)
钪和无机配位体的络合物的稳定常数(续表4)
常用浸出剂及其应用
固相电解还原法实验的主要工艺参数
NaOH-KNaC4H4O6溶液电积法实验的工艺参数
处理含(Ta2O5+Nb2O5)2000 t的原材料中的消耗和产出
Ta2O5的杂质含量(ppm)
Amberllte IRA400对简单络合物吸附容量
金银氰化物的解吸
Effect of Cu2S ori the leaching rate of Ni3S2
Effect of Cu2+ on leaching fraction(%) reacted
Effect of particle size(d,) on leaching fraction reacted with time(t)
Variation of values of overall rate constant k with hydrogen ion concentration
Values of overall rate constant k at different temperatures
Influence of temperature on leaching rate with time (t)