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Effect of solidification on solder bump formation in solder jet process: Simulation and experiment TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红) School of Materials...; Abstract: To investigate the influence of the solidification on the solder bump formation......
Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapesPing Chen1,Xiu-Chen Zhao1,Ying Liu1,Hong Li1,Yong Wang21. School of Materials Science... on the aging resistance and mechanical properties of Sn3.0 Ag0.5 Cu(SAC)solder bump joints were investigated by high-temperature aging test and shear test.Three different SAC solder bump joints with barrel......
affected by the intermetallic layers formed at solder/under bump metallurgy(UBM) interface during reflow soldering as well as aging, need to be evaluated thoroughly. In high-density electronic interconnection, solder bump provides connection between bonding pad of the chips and the metallization on the substrate[1－3]. Molten droplet solder bumping as a new type bumping method is developed in recent......
Design Optimization of Pillar Bump Structure for Minimizing the Stress in Brittle Low K Dielectric Material LayerXin-Jiang Long1,Jin-Tang Shang11. Key Laboratory of MEMS of Ministry of Education,Southeast University摘 要:Cu pillar bump offers a number of advantages for flip chip packaging,compared to the conventional solder bump.However,due to its......
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J. Cent. South Univ. Technol. (2008) 15: 689-693 DOI: 10.1007/s11771-008-0128-2 Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO ZHOU Ji-cheng(周继承)1, 2... network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments......
were investigated by droplet direct laser fabrication method, which is compared with the interface structures for bump and pad under laser reflow bumping. The intermetallics evolution at solder bump/pad..., the (CuxNi1-x)6Sn5 layer is formed at the solder/pad interface during reflow. Key words: solder droplet; bump; lead-free solder; reflow; intermetallic compound 球栅阵列, 倒扣芯片等面阵列封装技术的关键为凸点制作[1-3], 凸点的......
and the size of bumps has also been reduced because the smaller bumps provide short responds and reduced delay times. The conventional bump fabrication can be classified into solder jet [1... Received 21 May 2012; accepted 4 October 2012 Abstract: Cu bump was transferred using a focused laser pulse for microelectronic packaging. An Nd:YAG laser pulse (maximum energy of 500 mJ; wavelength......
on the microhardness of electroless Ni-P [J]. Thin solid Films, 1999, 355/356: 472-479. [25] JANG J W, KIM P G, TU K N. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low... Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites WU Mao(吴 茂), QU Xuan-hui(曲选辉), HE Xin-bo(何新波), Rafi-ud-din, REN Shu-bin(任淑彬), QIN Ming......
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