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; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新...) Abstract: A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way......
Transactions on Components and Packaging Technologies, 2004, 27(4): 684-693. [6] TIAN Y H, WANG C Q. Shape prediction and reliability design of ball grid array solder joints [J]. Key Engineering Materials... Effect of solidification on solder bump formation in solder jet process: Simulation and experiment TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红) School of Materials......
Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls He Lijun1,Shi Likai1,Zhang Shaoming1,Xu Jun1,Zhang Shuguang1 (1.National Engineering Research Center for Non-Ferrous Metals Composites,General Research Institute for Non-Ferrous Metals,Beijing 100088,China) Abstract:Solder balls, which are used in advanced electronics packages such as BGA (Ball Grid Array......
network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments...: thermo-mechanical fatigue reliability; solder joints; plastic ball grid array; finite element analysis; Taguchi method; artificial neural network; particle swarm optimization ......
at the bump/pad interface and its influence on solder microstructure are studied in detail. 2 Experimental The eutectic Sn-3.0%Ag-0.5%Cu(mass fraction)solder ball with a diameter of 0.76 mm... were ultrasonic cleaned before experiment. During the experiment, the solder ball was heated to specific temperature (initial temperature) above melting point of solder and then dropped to the pad......
ball grid array(BGA) solder joint. The ratio of plastic strain to total strain was used to characterize the solder plasticity. SAC305/Cu, SAC0307 /Cu and SAC0705BiNi/Cu component solder joints were... Bi and Ni elements, the hardness and solder creep resistance of SAC0705BiNi solder are improved, and the good plasticity is still maintained. Key words: ball grid array solder joint; creep resistance......
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激光喷射钎料球键合焊点界面组织及其可靠性分析王晓林1,李明雨1,王春青2(1.广东省深圳市哈尔滨工业大学深圳研究院材料学科部2.哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001)摘 要:采用激光喷射钎料球键合技术以及Sn3.0Ag0.5Cu(质量分数,%)无Pb钎料球对厚Au焊盘进行了键合实验.采用SEM和EDS对焊点界面的微观组织进行了分析.采用冷热循环处理研究了焊点微观组织的演变及其对接头强度的影响.结果表明,由于钎焊过程的热量有限,导致焊盘上的Au层不能全部溶解到钎料中去,界面处形成Au+......
application [J]. Microelectron Eng, 2007, 84(11): 2634-2639. [10] ERIC C C, YAN S W, LEE R, HUANG X. Comparison of solder ball shear strength for various nickel platings on the band pads of a PBGA substrate... Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites WU Mao(吴 茂), QU Xuan-hui(曲选辉), HE Xin-bo(何新波), Rafi-ud-din, REN Shu-bin(任淑彬), QIN Ming......
J. Cent. South Univ. Technol. (2009) 16: 0339-0343 DOI: 10.1007/s11771-009-0057-8 Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag ZHOU Ping(周 萍), HU Bing-ting(胡炳亭), ZHOU Jie-min(周孑民), YANG Ying(杨 莺) (School of Energy Science and Engineering, Central South University, Changsha 410083, China) ......
