共搜索到2299条信息,每页显示10条信息,共230页。用时:0小时0分0秒427毫秒
THE EFFECTS OF PULSE BIAS VOLTAGE AND N2 PARTIAL PRESSURE ON TiAIN FILMS OF ARC ION PLATING (AIP) C.Sun1,M.S.Li1,S.L.Zhu1,L.S.Wen1,Fuhui WANG1 (1.Institute of Metal Research, The Chinese Academy... formation, microstruture and elemental component ofthe films were investigated. Key words:TiAlN film; pulse bias voltage; nitrogen partial pressure; arc ion plating; [全文内容正在添加中] ......
Effect of magnetic fields on pulse plating of cobalt filmsYU Yundan, LI Wei, LOU Junwei, GE Hongliang, SUN Lixia, JIANG Li, and WEI Guoying College of Material Science and Engineering, China Jiliang University, Hangzhou 310018, China摘 要:Magnetic fields parallel to the electrodes were introduced during a pulse plating process to obtain cobalt thin films......
surface is more obvious, and the change of preferred orientation and the shift of XRD peak take place. Key words: chromium aluminum nitride; arc ion plating; phase change; pulse bias 1 Introduction... Ming-sheng, WANG Fu-hui. Effects of nitrogen partial pressure and pulse bias voltage on (Ti,Al)N coatings by arc ion plating[J]. Surface and Coatings Technology,2003, 167: 197-202. (Edited by LONG......
of temperature and current density on the thickness and electrodeposition velocity, respectively. As shown in Fig.3, the thickness and electrodeposition velocity of direct current plating and pulse plating... average thickness is about 11.2 μm. Fig.5 shows the SEM images of chromium coating obtained from Table 1, As shown in Fig.5, the pulse plating layer is composed of Fig.5 SEM images of electrodeposition......
Formation mechanism of pulse current anodized film on AZ91D Mg alloy QIAN Jian-gang(钱建刚), WANG Chun(王 纯)1, LI Di(李 荻)1, GUO Bao-lan(郭宝兰)1, SONG Guang-ling(宋光铃)2 1. School of Materials Science...; Abstract: The kinetics of forming process of pulse current anodized film on AZ91D Mg alloy was studied by the voltage-time......
Effect of direct current and pulse plating on the EDM performance of copper-zirconium diboride compositesDongming Guo, Min Zhang, Zhuji Jin, and Renke Kang Key Laboratory of the Ministry of Education of China for Precision & Non-traditional Machining, Dalian University of Technology, Dalian 116024, China摘 要:Direct current and pulse plating of copper......
℃, pH value was about 5.5 and plating time was 2 h. Double-pulse parameters were as follows. Forward and reverse pulse duty cycles were controlled at 10%, forward and reverse pulse average current... SiO2 composite pulse electroplating [J]. Plating and Finishing, 2004, 26(6): 27-30. (in Chinese) (Edited by LI Xiang-qun)  ......
nanocrystalline pure metal, alloy, as well as composite coatings. Another assisting measure for electrochemical process is pulse plating. Compared with direct current deposition, pulse plating takes some... electrodeposition (PJED), combining jet electrodeposition and pulse plating, has gradually become a new trend and an important supplement in electrodeposition technique. In the present study......
Experiments Design for Hardness Optimization of the Ni-Cr Alloy Electrodeposited by Pulse PlatingI.Imanieh,E.Yousefi,A.Dolati,M.R.MohammadiDepartment of Materials Science and Engineering, Sharif University of Technology摘 要:The hardness of the Ni-Cr alloy which is electrodeposited in chloride solution,is optimized by design of experiment method(central......
Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti–Cu–N Films Deposited by Magnetic Field-Enhanced Arc Ion PlatingSheng-Sheng Zhao1,Yan-Hui Zhao2,Lv-Sha... steel substrates by magnetic field-enhanced arc ion plating.The effect of substrate pulse bias duty cycle on the chemical composition,microstructure,surface morphology,mechanical and tribological......