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; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新... vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively......
utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior... and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Key words: lead-free solder; Sn-Ag-Cu alloy; rare earth element; La; tensile properties 1 Introduction Increasing......
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ZHAO Xiao-yan(赵小艳), ZHAO Mai-qun(赵麦群), CUI Xiao-qing(崔小清), XU Tian-han(许天旱), TONG Ming-xin... is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical......
Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls He Lijun1,Shi Likai1,Zhang Shaoming1,Xu Jun1,Zhang Shuguang1 (1.National Engineering Research Center for Non... and Sn-4.0Ag-0.5Cu lead free solder balls with tight distribution and good sphericity of particles through optimization of processing parameters, forming a solid base for cost effectively producing solder balls. Key......
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad WANG Jian-xin(王俭辛)1, XUE Song-bai(薛松柏)1, FANG Dian-song(方典松)2, JU Jin-long..., China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow......
Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder SamplesJing Han1,Hongtao Chen1,Mingyu Li1,2,Chunqing Wang21. Department of Materials Science and Engineering,Shenzhen Graduate School,Harbin... have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy(SEM) was employed......
on a lot of unrealistic assumptions[19]. The global trend of lead free soldering makes lead-free solders, especially the SnAgCu solder, gradually substitute for the Sn-Pb solder in solder jet packaging... and solidification effects to predict the solder bump formation under nonequilibrium conditions. Development of the free surface flow modeling technique provides feasibility for modeling the droplet impingement onto......
Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu SubstrateQiulian Zeng 1,2) , Jianjun Guo 1) , Xiaolong Gu 1) , Xinbing Zhao 2) and Xiaogang Liu... and Engineering, Zhejiang University, Hangzhou 310027, China摘 要:Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package......
EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS C.Q. Wang1,Y.H. Tian1,W.F. Zhou1 (1.State Key Lab of Advanced Welding Production and Technology,Harbin...) on the characteristics of interfacial IMCs was weakened when subjected to the aging process. Key words:lead free solder; flip chip; aging; [全文内容正在添加中] ......
of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress-strain curves were compared... conditions. Key words: lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability  ......