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utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior... and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Key words: lead-free solder; Sn-Ag-Cu alloy; rare earth element; La; tensile properties 1 Introduction Increasing......
Influence of Composition on Properties of BNT-BT Lead-Free Piezoceramics Gao Chunhua1,Chen Zhigang1,Huang Xinyou1,Liu Huiping1 (1.School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China) Abstract:Lead-free piezoelectric ceramics of (Bi1/2Na1/2)TiO3-BaTiO3(BNT-BT) were prepared by the conventional piezoelectric ceramic preparation technique (free air atmosphere......
Piezoelectric and dielectric properties of Lix(K0.46Na0.54)1-xNb0.86Ta0.1Sb0.04O3 lead-free ceramics CHEN Zhi-wu(陈志武) 1, HU Jian-qiang(胡建强)2 1. College of Materials Science and Engineering, South...; Abstract: Lead-free piezoelectric ceramics Lix......
Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology HAN Zong-jie(韩宗杰)1, XUE Song-bai(薛松柏)1, WANG Jian-xin(王俭辛)1, ZHANG Xin(张 昕)1... carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also......
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad WANG Jian-xin(王俭辛)1, XUE Song-bai(薛松柏)1, FANG Dian-song(方典松)2, JU Jin-long..., China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow......
Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5%Ag solders SHEN Jun(沈 骏), LIU Yong-chang(刘永长), HAN Ya-jing(韩雅静), GAO Hou-xiu(高后秀), WEI Chen(韦 晨), YANG Yu-qin(杨.... Keywords: lead-free solder; Sn-3.5%Ag solder; eutectic reaction; intermetallic compounds; microhardness......
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ZHAO Xiao-yan(赵小艳), ZHAO Mai-qun(赵麦群), CUI Xiao-qing(崔小清), XU Tian-han(许天旱), TONG Ming-xin... is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical......
Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
