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-lattice points. Key words: Ti3Al alloy; electronic structure; physical property  ... Electronic structure and physical properties of hcp Ti3Al type alloys PENG Hong-jian(彭红建)1, 2, XIE You-qing(谢佑卿)2 1. School of Chemistry and Chemical Engineering, Central South University......
Analysis of Electronic Structures for SmCo5 Compound Li Hua1,ZHANG Changwen1,Guo Yongquan2,DONG Jianmin1,Li Wei2 (1.School of physics and Microelectronics, Shandong University, Jinan 250100, China;2.Institute of Functional Materials, Central Iron &Steel Research Institute, Beijing 100081, China) Abstract:The spin-polarized MS-Xα method is employed to study the electronic structure......
Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG...; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum......
than those of VO2. Key words: Au-VO2; electronic structure; optical property; First-principle 1 Introduction Vanadium dioxide is the most amazing technologically thermochromic material because...J. Cent. South Univ. (2017) 24: 270-275 DOI: 10.1007/s11171-017-3427-2 First-principle study of electronic structure and optical properties of Au-doped VO2 HUANG De-wei(黄德伟)1, ZHAO Cui-hua(赵翠华)1......
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J. Cent. South Univ. Technol. (2010) 17: 888-894 DOI: 10.1007/s11771-010-0572-7 First-principle investigation on electronic structures and elastic properties of Al-doped MoSi2 LIU Xiao-liang(刘小... and Technology, Central South University, Changsha 410083, China ? Central South University Press and Springer-Verlag Berlin Heidelberg 2010 Abstract: The electronic structures and elastic properties of Al......
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Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu... environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, particle volume......