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of Alloys and Compounds, 2003, 361(1/2): 222-226. [15] Kim D G, Kim G S, Suk M J, et al. Effect of heating rate on microstructural homogeneity of sintered W-15wt%Cu nanocomposite fabricated from W-CuO powder...-ming. Development of application and production in W-Cu materials[J]. Materials Science and Engineering of Powder Metallurgy, 2005, 10(1): 21-25. [5] 范景莲, 彭石高, 刘 涛, 等. 钨铜复合材料的应用与研究现状[J]. 稀有金属与硬质合金......
reductions synthesis of nanocomposite W-Cu powders [J]. Nanostructured Materials, 1997, 9(1-8): 213-216. [15]Bose A. Powder injection molding of tungsten heavy alloys [J]. Powder Metallurgy, 1998, 9(5... to prepare W-Cu powder. CuWO4·2H2O/Cu2WO4(OH)2 precipitates were first obtained by adding aqua ammonia into a liquor solution containing natrium tungstate and copper chloride, then the solution......
on microstructural homogeneity of sintered W-15wt%Cu nanocomposite fabricated from W-CuO powder mixture[J]. Scripta Materialia, 2004, 51: 677-681. [15] RYU S S, KIM G S, KIM J C, OH S T, KIM Y D...；电导率；致密化；微观组织 中图分类号:TG149.4+11 文献标志码:A Electric conductivities of ultrafine W-Cu materials ZHU Song, FAN Jing-lian, LIU Tao, TIAN Jia-min (State Key Laboratory of Powder......
)11-3762-07 Fabrication and microstructure of fine grain W-Cu FGM GUO Yaofeng, FAN Jinglian, JIANG Dongfu, LIU Tao (State Key Laboratory for Powder Metallurgy, Central South University, Changsha 410083...保护气氛于1 380 ℃下烧结120 min,使用德国Leica公司MeF3A金相显微镜观察样品显微组织,美国Buehler公司Micromet5104显微硬度仪检测梯度层维氏硬度,EDAX公司Nova NanoSEM230型能谱仪分析仪检测梯度层成分变化. 表1 复合样品梯度层粉末球磨时间 Table 1 Milling time of W-Cu powder......
and Engineering of Powder Metallurgy, 2005, 10(1): 21-25. [3] 杨明川, 宋贞祯, 卢 柯. W-20%Cu纳米复合粉的制备[J]. 金属学报, 2004, 40(6): 639-642.YANG Ming-chuan, SONG Zhen-zhen, LU Ke. Synthesis of W-20%Cu nanocomposite powders [J]. Acta Metallurgica Sinica, 2004, 40(6): 639-642. [4] 陈文革, 丁秉均. 钨铜基复合材料的研究及进展[J]. 粉末冶金工业, 2001, 11(3): 45-50.CHEN Wen-ge, DING Bing-jun. The progress and research of W-Cu matrix composites [J]. Powder......
and dilation of sintered W-Cu alloys[J]. The International Journal of Powder Metallurgy, 1998, 34(2): 43-52. [7]Lee J S, Kim T H. Densification and microstructure of the nanocomposite W-Cu powders[J...结时的晶粒尺寸约为300~350nm. 另外, Cu含量增加有利于烧结致密化, 并降低W晶粒长大的趋势. 关键词: 纳米W-Cu; 烧结致密化; 烧结 中图分类号: TF123.7 文献标识码: A Sintering behavior of nanograined W-Cu composite powder CAO Shun-hua, LIN Xin-ping, LI Jiong......
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heat sink[J]. Powder Metallurgy Technology, 2009, 27(6): 438-441. [7] ZHOU Zhang-jian, DU Juan, SONG Shu-xiang, et al. Microstructural characterization of W/Cu functionally graded materials produced... wt.% Cu powder mixture[J]. Journal of Alloys & Compounds, 2008, 463(1/2): 0-159. [10] DORE F, MARTIN C L, ALLIBERT C H. Apparent viscosity of W-Cu powder compacts during sintering[J]. Materials......
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Particle size distributions of two kinds of W powders used in experiments: (a) W powder A with big particle; (b) W powder B with small particle 三层结构W-Cu梯度功能材料的封接层,中间层,散热层的成分分别设计为:W/Cu20(表示混合层中... conductivity of W-Cu composites[J]. Adv Powder Metall Part Mater, 1993, 4: 201?213. [3] GERMAN R M. Model for the thermal properties of liquid-phase sintered composites[J]. Metall Trans A, 1997, 24......
