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Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi MethodLin Jiang1,2,Liang Zhang1,3,Zhi-Quan Liu1,21. Institute of Metal Research , Chinese Academy...="ChDivSummary">Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering......
Effect of process parameters on electrical, optical properties of IZO films produced by inclination opposite target type DC magnetron sputtering Do-Hoon SHIN1, Yun-Hae KIM2, Joong-Won...; Abstract: IZO films were deposited onto PET substrate at room temperature with the inclined opposite target type DC magnetron sputtering equipment, in which a sintered oxide......
Trans. Nonferrous Met. Soc. China 26(2016) 1353-1358 Effect of hydrogen peroxide concentration on surface properties of Ni-Cr alloys Mei-feng HE1, Hao WANG1, Hong...; Abstract: The effect of concentration of hydrogen peroxide (H2O2) on the surface properties of Ni-Cr alloys......
gradient of a rolled and subsequently annealed tantalum sputtering target was investigated. The results show that by carefully controlling the rolling process, shear-related components at the surface...Through-thickness texture gradient of tantalum sputtering targetChao Deng,Shi-Feng Liu,Xiao-Bo Hao,Jing-Li Ji,Qing Liu,Hai-Yang FanCollege of Materials Science and Engineering, Chongqing University摘......
were deposited on Si(111) substrates by RF magnetron sputtering equipment, and the compound target with 60 mm in diameter was provided by Mitsubishi Corporation. Two groups of samples were prepared... during the process of sputtering, the composition of GeSb2Te4 film, sometimes, still has certain oxygen, due to the degasification of the target clamp caused by the large quantity of heat, which......
as a function of the power. The growth rate of the Ag film was higher than that of the Pd film. Sputtering is the removal process of near-surface atoms from a target. The atoms of a target are able..., and then a 50 nm-thick Ni film, as an adhesion layer, was deposited by DC magnetron sputtering. After breaking the vacuum, 500 nm-thick Ag-Pd alloy films with different composition ratios (Ag to Pd......
; Ni-Cr alloy electrodepositing technology on Fe substrate and coating performance XU Li-jian(许利剑)1, 2, GONG Zhu-qing(龚竹青)1, TANG Jian-xin(汤建新)2, HE Quan-guo... Laboratory, Hunan University of Technology, Zhuzhou 412008, China) Abstract: The Ni-Cr alloy electrodepositing technology on iron substrate in the chlorid-sulfate solution and the impacts of main......
Research on fabricating technique of Ba-Al-S:Eu sputtering target丁曌1,喻志农1,张东璞1,薛唯1,王武育21. Department of Optical Engineering,School of Information Science and Technology,Beijing Institute of Technology2. Department of Mineral & Metallurgical Materials,General Research Institute for Non-Ferrous Metals摘 要:Ba-Al-S-Eu sputtering target for blue emitting......
reactive magnetron sputtering and annealed at different temperatures. The material properties were investigated by X-ray diffractometer, atom force microscope, ultraviolet and visible spectrophotometer... Ta2O5 thin films were deposited by DC reactive magnetron sputtering. Target was pure Ta metal (99.9%). Glass slide and Si(111) substrates were placed under the targets (60 mm in distance......
