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Trans. Nonferrous Met. Soc. China 24(2014) 1-11 Role of Kirkendall effect in diffusion processes in solids C. A. C. SEQUEIRA, L. AMARAL Materials Electrochemistry Group, ICEMS, Instituto Superior... reviews the Kirkendall effect from the circumstances of its discovery to recent developments in its understanding, with broad applicability in materials science and engineering. Key words: Kirkendall......
the Kirkendall effect [20]. The motion equations can be written as [20] (3) ... are shown in Fig. 9. Apparently, the average size of Kirkendall voids increases with increasing the evolutionary time, as shown in Fig. 9(a). There is only a small effect on the average size......
the NiFe2O4/NiO bonding interface and exhibits a deep penetration in the NiFe2O4 due to the Kirkendall effect. Furthermore, SEM observations reveal that the needle-like nickel ferrite precipitates form in NiO near the interface and the formation mechanism of them are inferred to be diffusion type solid-state phase changes. Key words: NiFe2O4; microstructure; diffusion; Kirkendall effect 1 Introduction......
数有较大差异,而在界面导致残余热应力是造成界面裂纹产生和扩展的主要原因.由于铝,钢接触反应时的Kirkendall效应使Fe2Al5层中产生较多的微孔,同时也由于该中间层较厚,因此微裂纹往往在该层中产生和扩展.拉剪测试后的断口分析表明材料主要沿铝／钢波形界面失效. 关键!词:爆炸焊接；中间相；Kirkendall赦应；固／液反应 中图分类号:TG 172 文... of these cracks are found to be parallel to the wavy in terface too. The residual stress due to different thermal expansion coefficients of the interacting phases and the volume change effect associated......
Kirkendall空洞率无明显影响.关键词:无铅焊点； 界面耦合； 金属间化合物； Kirkendall空洞； 剥离现象......
The accelerating nanoscale Kirkendall effect in Co films–native oxide Si(100) system induced by high magnetic fieldsYue Zhao1,2,Kai Wang2,Shuang Yuan3,Yonghui Ma4,Guojian Li2,Qiang Wang21. Institute... nanoscale Kirkendall effect. The diffusion mechanism in the presence of high magnetic fields was given to explain the increase of diffusion coefficient. The morphology evolution of Co films on native oxide......
一种研究Cu/Al界面原子扩散Kirkendall效应的新方法 耿相英1,李世春1 (1.中国石油大学机电学院材料系,东营,257061) 摘要:利用铆钉法制备了Cu-Al扩散偶.借助光学显微镜和彩色金相技术,通过分析烧结过程中销钉及销孔直径尺寸的变化,研究了Cu/Al界面原子扩散的Kirkandall效应.结果表明,在烧结温度范围内铜向铝中的扩散强度大于铝向铜中的扩散强度. 关键词:铆钉法; Cu-Al扩散偶; Kirkendall效应; [全文内容正在添加中] ......
Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟马文婧,柯常波,周敏波,梁水保,张新平华南理工大学材料科学与工程学院摘 要:采用二元合金晶体相场模型模拟研究了Sn/Cu互连体系Cu/Cu3Sn界面及金属间化合物层中Kirkendall空洞形成和形貌演化及长大过程,对Kirkendall空洞生长的微观机制进行了剖析,同时还模拟和分析了界面Cu3Sn层厚度和杂质含量对Kirkendall空洞形貌和生长动力学的影响.研究表明,Kirkendall空洞的生长过程由4个阶段组成:Cu/Cu3Sn界面形成大量原子错配区,原子错配区迅速成长为空洞,空洞的长大及随后的空洞合并生长.Kirkendall空洞优先在Cu/Cu3Sn界面处形核,其尺寸随时效时间的延长而增大,并在......
主要发生于Solder/IMC界面或/和IMC/IMC界面,而且断口形貌逐渐由韧窝状断口为主向解理型脆性断口转变.SEM研究发现,时效过程中界面IMC不断长大,增厚并呈针状或块状从Cu/Solder界面向焊点心部生长,时效1 000 h的焊点中IMC分层明显.半焊点结构为Cu/Cu3Sn/Cu6Sn5/Solder,同时,在靠近铜基体的IMC中有Kirkendall空洞存在. 关键词:金属间化合... is defined as Cu/Cu3Sn/Cu6Sn5/solder structure for the half-joints. Moreover, the Kirkendall voids can be observed in the multilayer structure close to the copper substrate. These voids are possibly one......
Sn基钎料/Cu焊点Kirkendall空洞抑制研究王曼,于治水,张培磊,郭志鹏,陈磊摘 要:无铅钎料Sn-3.5Ag/Cu焊点用于微电子封装电子器件的互连,随着电镀铜的使用,电镀铜中引入杂质,以及焊点尺寸减小,封装密度增大,产生的Kirkendall空洞会使焊点在服役过程中严重影响接头的可靠性.文章分析了Kirkendall空洞形成机制,研究了抑制Kirkendall空洞的措施.关键词:无铅钎料;电镀铜;Kirkendall空洞;抑制;......
