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theoretic guidance on silicon polishing rate and ensure to adjust optimal components of slurry. Key words: Chemical mechanical polishing(CMP); material removal rate(MRR); electrochemical.... Fig.9 Dependence of CMP material removal rate on concentration of CeO2 in slurries at pH 10.5 4 Conclusions 1) The results of polarization curves reveal that pH of the slurry has a pronounced......
and the coor dinate bond of Cu with 2S atom in ATMc. The intensity of intrared light are calculated for the four dynamic isomer of AMT, and shown in the IR spectrum. Key words: CMP slurry; AMT... chemical mechanical polishing[ J] . Thin Solid Films, 1997, 308 - 309: 518 - 522. [5] Roonald C, Janos F, Rahul J. Initial study on copper CMP slurry chemistries[J]. Thin Solid Films, 1995, 266: 238......
water-free slurry applying for CLBO crystal chemical mechanical polishing(CMP) was investigated. The abrasive is SiO2. The influence of polishing processing parameter on polishing process for CLBO..., we investigated a new water-free slurry which was applicable for CLBO crystal chemical mechanical polishing(CMP)[8,9]. We discussed the influence of polishing processing parameter on polishing process......
化学机械抛光技术及SiO2抛光浆料研究进展 王海波1,曲鹏1,邱冠周1,吴雪兰1,宋晓岚1 (1.中南大学资源生物学院,长沙,410083) 摘要:随着半导体工业和集成电路(IC)工艺的飞速发展,化学机械抛光(CMP)作为目前唯一能提供超大规模集成电路(VLSI)制造过程中全面平坦化的一种新技术,已成为各国争相研究的热点.介绍了CMP技术的产生,优势,发展,理论,设备与耗材;着重介绍了SiO2浆料的国内外研究现状,并展望了CMP技术及SiO2浆料的研究开发和应用前景. 关键词:化学机械抛光(CMP) SiO2 浆料; [全文内容正在添加中] ......
of the polycrystalline abrasive and the surfactant added to the slurry. It was found that the magnitude of the post-CMP oxide thickness deviation due to nanotopography increased with the surfactant... impact. Key words:CMP; slurry; ceria; abrasive; surfactant; nanotopography; [全文内容正在添加中] ......
不锈钢CMP抛光液的研制崔洪刚1,汪永超2,唐浩21. 广东工业大学2. 河源广工大协同创新研究院摘 要:简单介绍了不锈钢材料表面的几种加工工艺的优缺点,介绍了化学机械抛光(CMP)工艺的机理.介绍了抛光液的各成分及其作用机理,同时列举了一些常用的药品种类.针对不锈钢材料,通过理论分析或者实验对比,合理选择各个成分的药品种类,确定了二氧化硅,柠檬酸,过氧化氢,烷基酚聚氧乙烯醚和苯并三氮唑作为抛光液的主要成分.通过正交实验的方法确定了每个成分的最佳含量.最后采用优化后的CMP抛光液进行不锈钢的CMP实验,并对比不锈钢抛光前后表面质量验证抛光液的有效性.关键词:不锈钢;化学机械抛光;抛光液;成分;......
, 255(5): 3090-3096. [11] ARMINI S, WHELAN C M, MOINPOUR M, MAEX K. Composite polymer core-silica shell abrasives: The effect of polishing time and slurry solid content on oxide CMP[J]. Electrochemical... roughness variation and its effect on material removal profile in ceria-based CMP slurry[J]. Journal of Materials Processing Technology, 2008, 203(1/3): 287-292. (编辑 陈卫萍) 基金项目:江苏省工业支撑计划项目(BE2008037)；常州......
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纳米集成电路中镍基CMP工艺 吴碧艳1,罗文嬗1 (1.浙江工商大学计算机与信息工程学院,杭州,310015) 摘要:机械化学抛光(CMP)工艺普遍应用于纳/微机械制造中,特别是复杂的层状结构MEMS.鉴于镍及镍基合金具有高的沉积速率,可控的薄层应力,低的电阻和制备温度以及机械特性,本文研究了镍及镍基合金用于具有运动结构的纳/微EMS器件的可行性,重点研究了基于镍的CMP工艺,其电化学势的...学抛光; 纳/微机械; 镍; 电动势; CMP; nano/MEMS; nickel; potentiodynamic; [全文内容正在添加中] ......
Slurry electrolysis of ocean polymetallic nodule WANG Cheng-yan(王成彦), QIU Ding-fan(邱定蕃), YIN Fei(尹 飞), WANG Han-yuan(王含渊), CHEN Yong-qiang(陈永强) Beijing General Research Institute...: The ocean poly-metallic nodule was leached by using slurry electrolysis process in HCl-NaCl medium. The leaching rates of Mn, Co, Cu and Ni in the ocean poly-metallic nodule are all above 97......
