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Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapesPing Chen1,Xiu-Chen Zhao1,Ying Liu1,Hong Li1,Yong Wang21. School of Materials Science and Engineering,Beijing Institute of Technology2. Center of Packaging and Testing,Beijing Microelectronics Technology Institute摘 要:The effects of bump shape......
used to fabricate bumps on chip in electronic packaging[1-3]. It is well-known that the bump shape determines the reliability during service[4-6]. Accordingly, it is crucial to predict the solder bump... processing[9-11]. However, these models are based on the static or quasi static theories, and can only predict the final bump shape rather than the solder shape evolution. They are competent for predicting......
Received 21 May 2012; accepted 4 October 2012 Abstract: Cu bump was transferred using a focused laser pulse for microelectronic packaging. An Nd:YAG laser pulse (maximum energy of 500 mJ; wavelength... and the sacrificial layer, causing a shock wave. The shock wave pressure pushed the Cu layer and transferred material to deposit a bump on substrate. A beam-shaper was used to produce uniform pressure......
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J. Cent. South Univ. (2012) 19: 994-1001 DOI: 10.1007/s11771-012-1102-6 Industrial shape detecting system of cold rolling strip YANG Li-po(杨利坡)1, 2, YU Bing-qiang(于丙强)1, 2, DING Dong(丁栋)1, 2, LIU... Science and Technology, Yanshan University,Qinhuangdao 066004, China ? Central South University Press and Springer-Verlag Berlin Heidelberg 2012 Abstract: A high-precision shape detecting system......
J. Cent. South Univ. (2012) 19: 488-495 DOI: 10.1007/s11771-012-1030-5 Modified Fourier descriptor for shape feature extraction ZHANG Gang(张刚)1, MA Zong-min(马宗民)2, NIU Lian-qiang(牛连强)1, ZHANG Chun... pixel set of an object was computed, centroid distance approach was used to compute shape signature in the local space. A pair of shape signature and boundary pixel gray was used as a point......
Article ID: 1003-6326(2005)02-0340-04 Two-way shape memory effect and its stability in Ti-Ni-Hf high temperature shape memory alloy MENG Xiang-long(孟祥龙), WU Ye(吴 冶), CAI Wei(蔡 伟), ZHAO Lian-cheng(赵连城) (School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China) Abstract: The two-way shape memory effect(TWSME) in a Ti36Ni49Hf15 high......
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