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Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
Microstructures and properties of SnZn-xEr lead-free solders张亮1,2,崔俊华3,韩继光1,郭永环1,何成文11. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory... eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders......
Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology HAN Zong-jie(韩宗杰)1, XUE Song-bai(薛松柏)1, WANG Jian-xin(王俭辛)1, ZHANG Xin(张 昕)1... carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also......
Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5%Ag solders SHEN Jun(沈 骏), LIU Yong-chang(刘永长), HAN Ya-jing(韩雅静), GAO Hou-xiu(高后秀), WEI Chen(韦 晨), YANG Yu-qin(杨... on the environmental protection and health hazards of Sn-Pb solders used in electronic packaging have prompted the development for lead-free solder alternatives in electronic industry[1–3......
way for whisker growth trend, and some way to the mitigation whisker growth in the industry. Key words: plating; tin whisker; growth mechanism; lead-free solders 锡晶须在镀层表面自发生长现象最早由COMPTON等[1]于1951年报... is focused in materials science for long time. With the development of lead-free in electronic devices, the problems resulting from tin whiskers are going up. The spontaneous growth of tin whiskers can......
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrateCHEN Wenxue, XUE Songbai, WANG Hui, WANG Jianxin, and HAN Zongjie College of Materials....%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed......
of lead-free solders for Sn-Pb solders. The most widely recommended lead-free solders can be divided into Sn-Ag system, Sn-Cu system, Sn-Zn system, Sn-Bi system and Sn-In system. Even though the main stream... of the contact angle is obtained from the solder with 0.1% of Nd addition. REFERENCES [1]Mulugeta A, Guna S. Lead-free solders in microelectronics [J]. Materials Science and Engineering R, 2000, 27(5-6): 95-141......
with a relatively higher melting temperature. Therefore, the Sn-3.0Ag-0.5Cu solders with the addition of La can meet the requirement of the present lead-free soldering process. 3.2 X-ray diffraction analysis..., 376: 170-175. [8] SHEN Jun, LIU Yong-Chang, HAN Ya-jing, GAO Hou-xiu, WEI Chen, YANG Yu-qin. Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.5Ag solders[J]. Trans......
the properties of lead-free solders in different degrees. Based on the development of lead-free solders bearing RE at home and abroad, the effect of RE on the properties and microstructures of lead-free solders was reviewed systematically. The recent progress of soldered joints reliability was expatiated, which can provide data support for the application of these lead-free solders bearing RE. Through......
, and high-temperature and lead-free solders[11,12]. A number of different lasers have been used for soldering, while it has been found[12,13] that semiconductor diode laser is advantageous due... method is lower than that using diode-laser soldering method. References [1] ABTEW M, SELVADURAY G. Lead-free solders in micro- electronics [J]. Materials Science and Engineering R, 2000, 27(5-6......
