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Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG...; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum......
13 May 2010; accepted 25 June 2010 Abstract: Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process... with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials. Key words: thixo......
of Materials Science-Materials in Electronics, 2003, 14(1): 9-12. [12] Zhang Qiang. Microstructure and properties of a 70vol.% SiCp/Al-12Si composite for electronic packaging[J]. Materials Science Forum, 2005... Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu......
Introduction With the rapid development of electronic technology, materials with high properties for electronic packaging are needed urgently[1-3]. Many particles reinforced metal matrix composites... Conclusions 1) The concept of interpenetrating phase composites (IPCs) used for electronic packaging is proposed, which is the development direction of high property materials for electronic packaging......
Electronic packaging materials prepared by powder injecting molding and pressure infiltration processYIN Fazhang1), GUO Hong1), JIA Chengchang2), XU Jun1), ZHANG Ximin1), and ZHU Xuexin1) 1) National... School, University of Science and Technology Beijing, Beijing 100083, China摘 要:AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder......
Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoformingGUO Ming-hai(郭明海), LIU Jun-you(刘俊友), JIA Cheng-chang(贾成厂), JIA Qi-jin(贾琪瑾), GUO Shi-ju(果世驹) (School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China)Abstract:The electronic packaging shell with high......
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper compositesKai-Kun WangSchool of Materials Science and Engineering,University of Science and Technology Beijing摘 要:To fabricate electronic packaging shell of copper-matrix composite with characteristics of high thermal conductivity and low thermal expansion coefficient......
for electronic packaging applications [J]. Materials & Design, 2009, 30: 1-8. [3] ZHANG L, QU X H, HE X B. Thermo-physical and mechanical properties of high volume fraction SiCp/Cu composites prepared... Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications CHEN Guo-qin(陈国钦)1, XIU Zi-yang(修子扬)2, MENG Song-he(孟松鹤)3, WU Gao-hui(武高辉)1, ZHU......
density, multi-function, and high power electronic devices, requirements for high-performance electronic packaging materials, e.g., high thermal conductivity, strength and processability, low coefficient... of the new electronic packaging materials mentioned above, composite technology may be the only path that can be used currently. That is, by combining the functions of the components, the composites......
composites fabricated by low pressure infiltration are better than that by high pressure methods. Keyword: electronic packaging materials; functional composites; melt... and fabrication of hybrid 2D-C/Al composites for electronic packaging Abstract: The size and volume fraction of silicon carbide particle in hybrid C/ SiCp per-form were designed......