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in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire... parameter match is very important, because the bonding parameters can influence the bonding strength between IC chip and substrate directly. In thermosonic bonding processes, there are several kinds......
Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloyHong Li,Miao-Quan Li,Wei-Xin Yu,Hong-Bin LiuSchool of Materials Science and Engineering,Northwestern... min.The significance and interaction of bonding parameters with the bonding ratio were investigated.The results demonstrate that the effect of pressure on the bonding ratio is the most effective......
Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints G. MAHENDRAN1, V. BALASUBRAMANIAN2, T. SENTHILVELAN3 1. Department of Mechanical... in the microstructure and joint performance of Mg-Cu joints. However, diffusion bonding can be used to join these alloys without much difficulty. This work analyses the effect of parameters on diffusion layer......
at ambient temperature. Fig.1 Schematic drawing of Cu wire wedge bonding process After wedge bonding, pull test was performed on DAGE 4000 to get the pull force of the bond. For a parameters setting, 20... metallization when the appropriate bonding parameters are chosen. With the increasing of the ultrasonic power, the thickness of the gold layer at the center of the metallization decreases. This is because......
. The two kinds of changes result in reducing bonding strength greatly. The optimum diffusion bonding parameters are determined as follows: T=773K, t=1226s and p=6MPa, at which the tensile strength...Diffusion bonding of Al alloy to Al2O3 ceramicFENG Ji-cai(冯吉才), WANG Da-yong(王大勇), LI Zhuo-ran(李卓然), LIU Hui-jie(刘会杰)(National Key Laboratory of Advanced Welding Production Technology,Harbin......
Article ID: 1003-6326(2005)03-0497-07 Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy ZHANG Jie(张 杰)1... was 15%(molar fraction). The effect of bonding parameters on the microstructure and mechanical properties of the Si3N4/Si3N4 joint were investigated. The results indicate that with increasing brazing......
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parameters and bonding strength, the bonding parameters such as interface stress, temperature, and ultrasonic vibration during bonding process were monitored and friction models of bonding interface were... with the bonding parameters listed in Table 1. Table 1 Bonding parameters of experiment The ultrasonic power was changed by adjusting ultrasonic power ratio (the ultrasonic power ratio is defined as the ratio......
strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1 ×10-4s-1 at 1253K. The diffusion bonding parameters, including the bonding... parameters for the diffusion bonding are: T= 1273-1323K, p = 20-30MPa, t = 45-60min. Key words:superplasticity; diffusion bonding; nickel foil; IN718 alloy; [全文内容正在添加中] ......
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