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effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250...℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 ......
Sn-Ag-Cu-Ce钎料润湿性能及焊点力学性能研究 王俭辛1,韩宗杰1,陈燕2,禹胜林1,薛松柏1 (1.南京航空航天大学,材料科学与技术学院,南京,210016;2.哈尔滨焊接研究所,哈尔滨,150080;3.中国电子科技集团公司,第14研究所,南京,210013) 摘要:基于润湿平衡原理研究了微量稀土元素Ce对Sn-Ag-Cu-Ce无铅钎料在Cu基板上润湿性能的影响规律,研究了Sn-Ag-Cu-Ce焊点的力学性能及断口形貌.结果表明,随着稀土Ce含量的增加,钎料在Cu基板上的润湿时间逐渐缩短,润湿角逐渐减小,当Ce的质量分数在0.03%~0.05%时,Sn-Ag-Cu-Ce钎料的润湿性能较好.且当Ce的含量为0.03%左右时,Sn-Ag-Cu-Ce焊点的力学性能达到最佳值,焊点断口呈现均匀的韧窝形貌,断裂方式以韧性断裂为主. 关键词:无铅钎料; 润湿性能; 力学性能......
Ce的添加对Sn-Ag-Cu合金电阻率和组织的影响赵雪梅,范曼杰,李先芬合肥工业大学材料科学与工程学院摘 要:通过Ce的添加以及熔体结构转变两个方面探究其对Sn-3.8Ag-0.7Cu的影响.运用直流四电极法测量Sn-3.8Ag-0.7Cu-XCe(X=0%,0.2%,0.5%,1%)合金在液相线以上电阻率随温度的变化,得出无铅焊料Sn-3.8Ag-0.7CuXCe合金存在温度诱导的熔体结构转变,并且这种转变是可逆的.随着Ce添加量的增加,合金的熔点升高.凝固实验结果显示,熔体结构转变以及稀土元素Ce的添加均可以细化合金微观组织,且当Ce的添加量为0.2%时,微观结构最细小均匀.关键词:Sn-Ag-Cu-Ce合金;熔体结构转变;电阻率;凝固;......
The Strengthening of Cu-15Ni-8Sn Alloy WANG Ming-Pu1,WANG Yan-hui1,HONG Bin1 (1.School of Material Science and Engineering, Central South University, Changsha China) 摘要:The microstructure, property and relation between them of Cu-15Ni-8Sn alloy are studied by means of TEM and the measurement of hardness. The results show that γ '' metastable phase strengthens alloy because of its ordering......
The Technological Improvements of Aluminum Alloy Coloring by Electrolysis LI Nai-jun1 (1.Teachers College, Shenyang University, Shenyang 110015, P. R. China) 摘要:The technological process of coloring golden-tawny on aluminum alloy by electrolysis was improved in this paper. The optimum composition of electrolyte was found, the conditions of deposition and anodic oxidation by electrolysis were......
Microstructure and Performances of Nanocrystalline Zinc-nickel Alloy Coatings LI Guang-yu1,NIU Li-yuan1,JIANG Zhong-hao1,LIAN Jian-she1 (1.The Key Lab of Automobile Materials, Ministry of Education, China, College of Materials Science and Engineering, Jilin University, Nanling Campus, Changchun, 130025, China) 摘要:Nanocrystalline zinc-nickel alloy coatings were deposited from an alkaline......
Alloy 20不锈钢薄板等离子弧焊接工艺研究赵斌,王宾宾,王小华中国船舶重工集团公司第七二五研究所摘 要:对Alloy 20不锈钢薄板进行了等离子弧焊接工艺试验研究.结果表明,采用等离子弧焊接方法,ERCr Ni Mo-3焊材及合理的焊接工艺参数,等离子弧焊接工艺可用于Alloy 20不锈钢薄板的焊接,焊接接头各项性能均能满足要求.关键词:Alloy 20;不锈钢薄板;等离子弧焊接;......
)Abstract:Stainless die with micro-groove and micro-hole have been designed and manufactured, which has been used to study superplastic microforming of 2091Al-Li alloy by means of superplastic forming... micro-rib specimen, behavior of material could be understood well.Key words:superplasticity; microforming; extrusion; 2091Al-Li alloy......
Trans. Nonferrous Met. Soc. China 22(2012) s656-s660 Microforming of superplastic 5083 aluminum alloy Md. Abu Mowazzem HOSSAIN1, Sung-Tae HONG1, Kyu-Yeol PARK1, Young-Sang NA2 1. School of Mechanical...: The mechanical behavior of superplastic 5083 aluminum alloy during microforming process was investigated by finite element analysis. A micro V-groove die was modeled to analyze the effects of forming......
Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures.... With regard to soldered joints, microstructures formation of the interface between Sn-Ag-Cu-Ce solder and Cu substrate (soldering seam) is different from that of Sn-Ag-Cu-Ce alloy itself, as a result......
