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and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Key words: lead-free solder; Sn-Ag-Cu alloy; rare earth element; La; tensile properties 1 Introduction Increasing..., WANG L. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J]. Journal of Alloys and Compounds, 2004......
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ZHAO Xiao-yan(赵小艳), ZHAO Mai-qun(赵麦群), CUI Xiao-qing(崔小清), XU Tian-han(许天旱), TONG Ming-xin... is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical......
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad WANG Jian-xin(王俭辛)1, XUE Song-bai(薛松柏)1, FANG Dian-song(方典松)2, JU Jin-long... IR reflow soldering method. Key words: diode-laser soldering; Sn-Ag-Cu lead-free solder; shear force; microstructure 1 Introduction With low cost, Sn-Pb alloy has been widely used in electronic......
-Cu series solder. Key words: lead-free solder; micro-indentation; modulus of elasticity; creep strain rate sensitivity; Sn-Ag-Cu series Sn-Ag-Cu系列钎料蠕变压痕加载速率对压入深度的影响 Fig.5 Effects of loading rate on penetration depth for Sn-Ag-Cu lead-free solder alloys 由方程(6)和......
are precipitated along the eutectic bonds after aging. Key words: Sn-Ag-Cu lead-free solder; La; soldering; aging; intermetallic compound ...-long, HAN Zong-jie, YAO Li-hua. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad[J]. Trans Nonferrous Met Soc China, 2006, 16(8......
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℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 .... The solidus, wettability and spreadability of the fine solder powder were investigated in order to assess the effect of Ce on the properties of lead-free Sn-Ag-Cu- Ce micron- (or nano-) powdered solder. 2 ......
EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS C.Q. Wang1,Y.H. Tian1,W.F. Zhou1 (1.State Key Lab of Advanced Welding Production and Technology,Harbin...) on the characteristics of interfacial IMCs was weakened when subjected to the aging process. Key words:lead free solder; flip chip; aging; [全文内容正在添加中] ......
; 合金过热度; 有效雾化率; 粉末特性; Sn-Ag-Cu lead-free solder powder; inner diameter of delivery tube; superheat condition for alloy; efficient atomization efficiency; property of powder; [全文内容正在添加中] ...Sn-Ag-Cu无铅焊锡粉末雾化工艺参数的优化 王党会1,许天旱1 (1.西安石油大学材料科学与工程学院,陕西,西安,710065;2.西安交通大学材料科学与工程学院,陕西,西安,710049) 摘要:利用自行设计的超音速雾化制粉装置,通过正交实验法对Sn3Ag2.8Cu无铅焊锡粉末的雾化工艺参数进行优化,研究合金过热度和导液管内径对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率,平均粒径,粒......
,在本试验条件下,导液管突出高度最佳为4 mm. 关键词:无铅焊锡粉末; 气体雾化; 导液管突出高度; 粉末特性; Sn-Ag-Cu lead-free solder powder; gas atomizing; protrusion height of delivery tube; powder properties; [全文内容正在添加中] ...导液管突出高度对Sn-Ag-Cu无铅焊锡粉末特性的影响 王党会1,许天旱2 (1.西安交通大学材料科学与工程学院,陕西,西安,710049;2.西安石油大学材料科学与工程学院,陕西,西安,710065) 摘要:利用自行设计的超音速雾化制粉装置,研究了导液管突出高度对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率,粒度分布,球形度及氧含量的影响.结果表明:在一定雾化条件下,导液管突出高度为4......
