Study on Cure Behavior of a Model Epoxy System by Means of TTT Diagram
来源期刊：材料工程2006年第5期
论文作者：TANG Bang-ming AN Xue-feng ZHANG Ming YI Xiao-su
关键词：epoxy resin; cure behavior; TTT diagram;
摘 要：Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper.Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model.The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0, gel Tgand Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.
TANG Bang-ming1，AN Xue-feng1，ZHANG Ming1，YI Xiao-su1
(1.National Key Laboratory of Advanced Composites, Beijing Institute of Aeronautical Materials, Beijing 100095, China)
摘要:Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper.Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model.The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0, gel Tgand Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.
关键词:epoxy resin; cure behavior; TTT diagram;
【全文内容正在添加中】
