Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics
来源期刊：材料导报2020年第14期
论文作者：张墅野
文章页码：14001 - 14002
摘 要：<正>Wearable electronics in future necessarily assemble integrated circuits （ICs） on printed circuit board （PCB） or flexible printed circuit （FPC） substrates[1]. Before that,flex-on-board （FOB）assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics,such as smart watches[2]. FOB is an alternative interconnection for the conventional socket-type interconnection[3],by achieving a thinner package
张墅野
State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology
摘 要：<正>Wearable electronics in future necessarily assemble integrated circuits （ICs） on printed circuit board （PCB） or flexible printed circuit （FPC） substrates[1]. Before that,flex-on-board （FOB）assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics,such as smart watches[2]. FOB is an alternative interconnection for the conventional socket-type interconnection[3],by achieving a thinner package
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