Oxidized film on Cp/Cu-Cd electrical contact material
来源期刊：中国有色金属学报(英文版)2005年第z2期
论文作者：邵文柱 甄良 李义春 崔玉胜 周劲松
文章页码：251 - 255
Key words：Cu-based composites； electrical contact materials； XPS； oxidation
Abstract: Constituents of the oxidized surface film on diamond particles reinforced Cu-Cd alloy matrix composite （Cp/Cu-Cd） were investigated by XPS. The results show that Cu2O is the main constituent when the oxidized film is thin; CuO appears only after the film is rather thick. The originally formed oxidized film on the Cp/Cu-Cd is about 10nm in thickness and is mainly composed of Cu2O and Cu. After oxidized at 120℃ over 30h, CuO is detected in the film.
