几种铜材组织缺陷的电镜与能谱分析
来源期刊:有色金属科学与工程2011年第3期
论文作者:刘徽平 胡咏梅
文章页码:3 - 5
关键词:铜材; 组织缺陷; 扫描电镜; 能谱分析;
Key words:copper; structure defect; SEM; energy spectrum analysis
摘 要:对生产中常见的铜材组织缺陷采用扫描电镜、能谱仪进行分析,归纳出3种典型组织缺陷表面粘连、气孔和内部夹杂物的形貌与成分特征.
Abstract: This paper studies several common structure defects in copper production process by SEM and EDS.The morphology and composition features of typical defects,such as excessive outgrowth,gas holes and nonmetallic inclusions are summed up.
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