膜法处理印制线路板PCB酸性含铜电镀废水

刘久清，刘海翔，周钦

(中南大学 冶金科学与工程学院，湖南 长沙，410083)

摘 要：采用纳滤膜和反渗透膜组合处理含铜酸性电镀废水，通过试验考察操作压力、流量、温度等对渗透通量和截留率的影响。研究结果表明：在合适的操作条件下，纳滤膜对Cu²⁺的截留率在96%以上；反渗透膜对Cu²⁺的截留率在98%以上。纳滤膜较佳操作条件为：温度26 ℃，操作压力1.5 MPa，流量16 L/min。反渗透膜较佳操作条件为：温度36 ℃，操作压力2.0 MPa，流量14 L/min。

关键词：纳滤膜；反渗透膜；印制线路板；铜；电镀废水

Treatment of acid copper-containing electroplating wastewater using membrane

LIU Jiu-qing, LIU Hai-xiang, ZHOU Qin

(School of Metallurgical Science and Engineering, Central South University, Changsha 410083, China)

Abstract:The nanofiltration (NF) membrane and reverse osmosis membrane (RO) were used to treat the copper-containing acid electroplating waste water produced by printed circuit board (PCB), and the effects of trans-membrane pressure (TMP), flow velocity and temperature on the permeate flux and Cu²⁺ rejection were studied. The result shows that under optimal condition, Cu²⁺ retention of NF is over 96% and that of RO is over 98%. The optimum operating conditions for NF membrane are as follows: temperature 26 ℃, TMP 1.5 MPa, flow velocity 16 L/min, and for RO membrane: temperature 36 ℃, TMP 2.0 MPa, and flow velocity 14 L/min.

Key words:nanofiltration (NF); reverse osmosis (RO); printed circuit board (PCB); copper; electroplating wastewater