Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO

来源期刊:中南大学学报(英文版)2008年第5期

论文作者:周继承 肖小清 恩云飞 陈妮 王湘中

文章页码:689 - 689

Key words:thermo-mechanical fatigue reliability; solder joints; plastic ball grid array; finite element analysis; Taguchi method; artificial neural network; particle swarm optimization

Abstract: Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network (BPNN) was used to establish the nonlinear multivariate relation ship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board (PCB) size, PCB thickness, substrate size, substrate thickness, PCB coefficient of thermal expansion (CTE), substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77 dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.

基金信息:the National Natural Science Foundation of China
the National Defense Science and Technology Foundation of Key Laboratory, China

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