固溶加热速率与Al-Mg-Si-Cu合金力学性能、显微组织及织构的关系

来源期刊:中国有色金属学报(英文版)2021年第1期

论文作者:汪小锋 郭明星 彭文飞 王永刚 庄林忠

文章页码:36 - 52

关键词:Al-Mg-Si-Cu合金;固溶加热速率;力学性能;显微组织;织构

Key words:Al-Mg-Si-Cu alloy; solution heating rate; mechanical properties; microstructure; texture

摘    要:通过拉伸试验、扫描电镜、X射线衍射仪和EBSD技术研究固溶加热速率与Al-Mg-Si-Cu合金力学性能、显微组织及织构的关系。实验结果表明,固溶加热速率与力学性能、显微组织及织构的关系是非单调的。随着加热速率的增加,强度变化取决于拉伸方向;加工硬化指数n先减小,后增加;塑性应变比r值先增加,后减小,最后又增加。加热速率对合金最终显微组织和织构有一定影响。随着加热速率的增加,显微组织由拉长晶粒组织转变为等轴晶粒组织,平均晶粒尺寸呈先减小、然后增加、最后再减小的趋势。随着加热速率的增加,尽管织构组分如CubeND{001}á310?和P{011}á122?基本无变化,但织构密度和体积分数呈现先减小、后增加、最后减小的趋势。加热速率对显微组织和织构演变的影响较小。提高加热速率并不总是有利于形成细小的等轴晶粒组织、弱织构以及较大的平均r值,这些与合金的再结晶行为有关。

Abstract: The relationship among heating rate, mechanical properties, microstructure and texture of Al-Mg-Si-Cu alloy during solution treatment was investigated through tensile test, scanning electron microscope, X-ray diffractometer and EBSD technology. The experimental results reveal that there is a non-monotonic relationship among solution heating rate, mechanical properties, microstructure and texture. As the solution heating rate increases, the strength variations are dependent on the tensile direction; work hardening exponent n decreases first, and then increases; plastic strain ratio r increases first, and then decreases, and finally increases. The final microstructure and texture are also affected by heating rate. As heating rate increases, the microstructure transforms from elongated grain structure to equiaxed grain structure, and the average grain size decreases first, and then increases, and decreases finally. Although the texture components including CubeND{001}á310? and P{011}á122? orientations almost have no change with the increase of heating rate, the texture intensity and volume fraction decrease first, and then increase, and finally decrease. Both microstructure and texture evolutions are weakly affected by heating rate. Improving heating rate is not always favorable for the development of fine equiaxed grain structure, weak texture and high average r value, which may be related to the recrystallization behavior.

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