MICROSTRUCTURES AND MECHANICAL PROPERTIES OF Ti(C, N) FILMS DEPOSITED BY PEMSIP

来源期刊：中国有色金属学报(英文版)1999年第2期

论文作者：Li Sheng Wang Yukui Wu Enxi Han Huimin

文章页码：347 - 351

Key words：PEMSIP,　interlayer　,adhesion strength　,crystalline orientation relationship

Abstract: Ti(C, N) films were deposited by Plasma Enhanced Magnetron Sputtering Ion Plating (PEMSIP), and their microstructures and properties were investigated by means of XRD,AES, TEM and scratch test.The results showed that an interlayer about 80 nm thickness was formed between the high speed steel (HSS) substrate and Ti(C, N) films. In addition, crystalline orientation relationships were found among the substrate, interlayer and Ti(C, N) films. Therefore, the Ti(C, N) films combine high hardness and excellent adhesion strength.