7A55铝合金-RRA态厚板组织和性能及其 不均匀性的多因素影响

来源期刊:中国有色金属学报2019年第6期

论文作者:冯迪 刘胜胆 韩念梅 陈洪美 曹文奎 韩仲杰

文章页码:1150 - 1161

关键词:析出相;再结晶;织构;7A55铝合金;厚板;不均匀性

Key words:precipitate; recrystallization; texture; 7A55 aluminum alloy; thick plate; inhomogeneity

摘    要:采用力学性能测试、电导率测试、差示扫描量热(DSC)分析、微观组织观察以及织构分析研究预时效温度、回归加热速率、再结晶及Taylor因子对回归再时效(RRA)态7A55铝合金厚板组织、性能及其厚向不均匀性的影响。结果表明:厚板芯部低密度和粗大的析出相(η'''' 和η)导致板材芯层硬度低于表层的,芯层电导率高于表层的。硬度和电导率的厚向不均匀性随着回归加热速率的降低而减小,与预时效程度无关。然而,板材表层相对较高的固溶再结晶程度降低亚结构强化效果,并增加再结晶织构组分,低Taylor因子反而使RRA态厚板表层的轧向屈服强度低于芯层的。欠时效+慢速回归加热回归再时效可以达到与传统RRA类似的性能,且慢速回归加热更符合厚板的实际热处理条件。

Abstract: Mechanical properties test, electrical conductivity, differential scanning calorimetry(DSC), microstructure observation and texture analysis were used to investigate the effect of pre-ageing temperature, retrogression heating rate, recrystallization and Taylor factor on the microstructure, properties and through-thickness inhomogeneity of 7A55-RRA treated aluminum alloy thick plates. The results show that, the precipitates (η'''' and η) with relatively lower density and coarsened size in central layer results in lower hardness value and higher electrical conductivity than those of surface layer. The inhomogeneity of hardness and electrical conductivity decrease with the retrogression rate decreasing regardless of the pre-ageing temper. However, the substructure strengthening effect decreases and the recrystallized texture increases due to the deeper degree of recrystallization after solid solution in surface layer. The lower Taylor factor in surface layer results in a lower yield strength along rolling direction. The thick plate obtains a similar properties as that of traditional RRA after under ageing + slow heating retrogression and re-ageing, and the slow heating rate much more fits the engineering reality for thick plate heat treatment.

相关论文

  • 暂无!

相关知识点

  • 暂无!

有色金属在线官网  |   会议  |   在线投稿  |   购买纸书  |   科技图书馆

中南大学出版社 技术支持 版权声明   电话:0731-88830515 88830516   传真:0731-88710482   Email:administrator@cnnmol.com

互联网出版许可证:(署)网出证(京)字第342号   京ICP备17050991号-6      京公网安备11010802042557号