Microstructures and properties of SnZn-xEr lead-free solders

张亮^1,2，崔俊华³，韩继光¹，郭永环¹，何成文¹

1. School of Mechanical & Electrical Engineering, Jiangsu Normal University2. Provincial Key Laboratory of Advanced Welding, Jiangsu University of Science and Technology3. Department of Basic Experiment, Naval Aeronautical and Astronautical University

摘 要：The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders, 0-0.5 wt.% of rare earth Er was added to the base alloys, and the microstructures were studied. Results showed that the addition of rare earth Er could enhance the wettability of SnZn solders, with 0.08%Er addition, the spreading area gave an 19.1% increase. And based on the mechanical testing, it was found that the tensile force and shear force of SnZn-xEr solder joints could be improved significantly. Moreover, the oxidation resistance of SnZn0.08Er solder was better than that of SnZn solder. In addition, it was found that trace amounts of rare earth Er could refine the microstructures of SnZn solders, especially for Zn-rich phases, and excessive amount of rare earth Er led to a coarse microstructure.

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