新型核-壳结构PS/CeO2和PS/SiO2复合磨料的制备及其抛光性能

来源期刊:中国有色金属学报2010年第8期

论文作者:陈杨 隆仁伟 陈志刚 陈爱莲

文章页码:1612 - 1617

关键词:PS/CeO2复合磨料;PS/SiO2复合磨料;核-壳结构;包覆;化学机械抛光

Key words:PS/CeO2 composite abrasives; PS/SiO2 composite abrasives; core-shell structure; coating; chemical mechanical polishing

摘    要:以聚苯乙烯(PS)微球为内核,采用液相法制备具有核壳结构的PS/CeO2和PS/SiO2复合颗粒。利用X射线衍射仪、透射电子显微镜、场发射扫描电子显微镜、傅里叶转换红外光谱仪和热重分析仪等对所制备样品的物相结构、形貌和粒径等进行表征。将所制备的复合磨料用于硅晶片表面二氧化硅介质层的化学机械抛光,采用原子力显微镜观察抛光表面的微观形貌,并测量表面粗糙度。结果表明:所制备的PS/CeO2和PS/SiO2复合颗粒呈近球形,粒径为250~300 nm,且具有核壳包覆结构,包覆层的厚度为10~20 nm;硅晶片表面二氧化硅介质层经PS/CeO2和PS/SiO2复合颗粒抛光后,表面无划痕,且非常平整,在5 μm×5 μm范围内,粗糙度均方根值(RMS)分别为0.238 nm和0.254 nm。

Abstract: The PS/CeO2 and PS/SiO2 composites with core-shell structure were prepared by chemical precipitation method using polystyrene (PS) as core and ceria (silica) nanoparticles as shell. The phases structures, morphologies and particle size of PS/CeO2 and PS/SiO2 composite particles were analyzed by X-ray diffractometry (XRD), transmission electron microscopy (TEM), field emission scanning electron microscopy (FESEM), fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA). The thermal oxide film covered silicon wafer was chemical mechanical polished (CMP) by composite abrasives, and the polishing behavior of the novel composite abrasives was characterized by atomic force microscope (AFM). The results indicate that PS/CeO2 and PS/SiO2 composite particles with core-shell morphology are obtained successfully, the particles size is 250~300 nm and PS microspheres are uniformly coated by CeO2 or SiO2. AFM 2D-morphologies show that the polished surface becomes smooth and micro-scratch can hardly be observed. The root-mean-square roughness values within area of 5 μm×5 μm is 0.238 nm and 0.254 nm, respectively after thermal oxide film surface polished with PS/CeO2 and PS/SiO2 composite abrasives.

基金信息:江苏省工业支撑计划资助项目

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