废镀金电子元件的细菌脱镀

来源期刊：中南大学学报(自然科学版)1987年第1期

论文作者：何福煦 傅群英 卢宜源

文章页码：26 - 30

关键词：金； 二次金属； 废品回收； 镀金； 细菌冶金

Key words：gold； secondary metals； discarded products recovery； gold plating； bacterial metallurgy

摘    要：本文研究了废镀金电子元件的细菌脱镀,在20-35℃的温度下,经过约两天的处理,可将约97%的金镀层剥离下来.脱镀后,金呈碎片状留于溶液中,而废元件大都保持其原来状态,极易与溶液分离.文中讨论了脱镀速度、脱镀机理、脱镀液中 Fe²⁺离子的浓度及脱镀后液的细菌再生问题.此法的主要优点是工艺简单、操作条件较好和不用昂贵的化学试剂.

Abstract: Gold reclamation from gilded waste electronic elements by bacterial leaching has been studied.At 20-35℃ after treatment for a period of two days,about 97% of the gold layer can be stripped off in the form of flakes from the gilded elements. The degilded elements usually maintain their original form or shape and can be easily separated from the leached solution.Rate and mechanism of degilding,Fe³⁺ ion concentration in the leaching solution and bacterial regeneration of the leached solution are discussed.The chief advantages of this process are simplicity in technology,better operational conditions and unnecessity of expensive chemical reagents.