Evaluation of the microstructure, thermal and mechanical properties of Cu/SiC nanocomposites fabricated by mechanical alloying
来源期刊：International Journal of Minerals Metallurgy and Materials2021年第3期
论文作者：Essam B.Moustafa Mohammed A.Taha
摘 要：Nano-sized silicon carbide（Si C: 0 wt%, 1 wt%, 2 wt%, 4 wt%, and 8 wt%） reinforced copper（Cu） matrix nanocomposites were manufactured, pressed, and sintered at 775 and 875°C in an argon atmosphere. X-ray diffraction（XRD） and scanning electron microscopy were performed to characterize the microstructural evolution. The density, thermal expansion, mechanical, and electrical properties were studied. XRD analyses showed that with increasing Si C content, the microstrain and dislocation density increased, while the crystal size decreased. The coefficient of thermal expansion（CTE） of the nanocomposites was less than that of the Cu matrix. The improvement in the CTE with increasing sintering temperature may be because of densification of the microstructure. Moreover, the mechanical properties of these nanocomposites showed noticeable enhancements with the addition of Si C and sintering temperatures, where the microhardness and apparent strengthening efficiency of nanocomposites containing 8 wt% Si C and sintered at 875°C were 958.7 MPa and 1.07 vol%-1, respectively. The electrical conductivity of the sample slightly decreased with additional Si C and increased with sintering temperature. The prepared Cu/Si C nanocomposites possessed good electrical conductivity, high thermal stability, and excellent mechanical properties.
Essam B.Moustafa1，Mohammed A.Taha2
1. Mechanical Engineering Departments, Faculty of Engineering, King Abdulaziz University2. Solid State Physics Department, National Research Centre
摘 要：Nano-sized silicon carbide（Si C: 0 wt%, 1 wt%, 2 wt%, 4 wt%, and 8 wt%） reinforced copper（Cu） matrix nanocomposites were manufactured, pressed, and sintered at 775 and 875°C in an argon atmosphere. X-ray diffraction（XRD） and scanning electron microscopy were performed to characterize the microstructural evolution. The density, thermal expansion, mechanical, and electrical properties were studied. XRD analyses showed that with increasing Si C content, the microstrain and dislocation density increased, while the crystal size decreased. The coefficient of thermal expansion（CTE） of the nanocomposites was less than that of the Cu matrix. The improvement in the CTE with increasing sintering temperature may be because of densification of the microstructure. Moreover, the mechanical properties of these nanocomposites showed noticeable enhancements with the addition of Si C and sintering temperatures, where the microhardness and apparent strengthening efficiency of nanocomposites containing 8 wt% Si C and sintered at 875°C were 958.7 MPa and 1.07 vol%-1, respectively. The electrical conductivity of the sample slightly decreased with additional Si C and increased with sintering temperature. The prepared Cu/Si C nanocomposites possessed good electrical conductivity, high thermal stability, and excellent mechanical properties.
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