X-ray diffraction analysis of cold-worked Cu-Ni-Si and

来源期刊:中国有色金属学报(英文版)2011年第3期

论文作者:A. KHEREDDINE F. HADJ LARBI L. DJEBALA H. AZZEDDINE B. ALILI D. BRADAI

文章页码:482 - 487

关键词:Cu-Ni-Si合金;显微组织;XRDLPA;Materials Analysis Using Diffraction软件

Key words:Cu-Ni-Si alloy; microstructure; XRD line profile analysis; Materials Analysis Using Diffraction software

摘    要:

研究经冷加工和退火处理的过饱和Cu-2.65Ni-0.6Si和Cu-2.35Ni-0.6Si-0.6Cr合金。采用软件MAUD分析其显微组织参数的演变,包括晶粒尺寸、应变均方根和位错密度等。结果表明,经过冷加工和退火处理的两种合金的显微组织参数都具有特定值。在450 ℃时效2.5~3 h的合金,其晶粒尺寸、应变均方根和位错密度等参数的净变化量与回复和再结晶过程相关。Cr作为第四组元添加到合金中没有明显改变形变和时效处理后合金的结构参数,因此也不影响合金的回复再结晶动力学。

Abstract: Cold worked and annealed supersaturated Cu-2.65Ni-0.6Si and Cu-2.35Ni-0.6Si-0.6Cr alloys were studied. The microstructural parameters evolution, including crystallite size, root mean square strain and dislocation density was analyzed using Materials Analysis Using Diffraction software (MAUD). The parameters for both alloys have typical values of cold deformed and subsequently annealed copper based alloy. A net change of the crystallite size, root mean square strain and dislocation density values of the alloys aged at 450 °C for 2.5-3 h seems corresponding to the recovery and recrystallization processes. Addition of Cr as quaternary element did not lead to any drastic changes of post deformation or ageing microstructural parameters and hence of recovery-recrystallization kinetics.

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