间隙杂质及其分布对烧结钼脆性的影响

来源期刊：中南大学学报(自然科学版)1982年第1期

论文作者：左铁镛 周美玲 王占一

文章页码：47 - 54

关键词：间隙杂质； 俄歇电子能谱分析； 晶界； 退火制度； 断口； 形变量； 室温脆性； 直接影响； 基本原因； 粉末冶金

摘    要：本文对粉末冶金烧结钼坯及钼板的断口作扫描电镜、俄歇电子能谱分析表明,间隙杂质氧、碳、氮等在晶界明显富集,是造成钼室温脆性的基本原因。试验还表明,钼坯的晶粒度、加工形变量以及退火制度等工艺参数对间隙杂质在晶界的浓度和分布有直接影响,因而导致钼板韧性的明显差异。研究结果为制订钼坯、韧性钼板加工工艺提供了试验依据。

Abstract:

The fracture surfaces of sintered billets and rolled plates of powder metallurgy molybdenum were studied by Scanning Electron Microscopy and Auger Electron Spectroscopy.It is shown that the segregation of interstitual impurities oxygen,carbon,nitrogen to grain boundaries is the primary cause of room-temperature embrittlement in powder metallurgy:molybdenum.

The grain size,as well as the amount of deformation and annealing pro- cedure,has direct effects on concentration and distribution of interstitual impurities at grain boundaries,thus having obvious effects on ductility of molybdenum billets and plates.

On the condition that the content of impurities,especially the intersti- tual impurities,is strictly controlled,adjusting the processing arid annealing procedure can optimize the ductility of molybdenum plates.